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The effect of twin plane spacing on the deformation of copper containing a high density of growth twins

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Abstract

In-situ tensile straining in a transmission electron microscope was used to investigate the role of twin plane spacing on the deformation and fracture mechanism of pure copper containing a high density of nanoscale growth twins. Real-time and post-mortem observations clearly reveal that twin plane spacing plays a key role in determining the operative deformation mechanism and therefore the subsequent crack propagation path. The deformation mechanism transition, which results from changes in the twin plane spacing, has implications for interpreting the unusual mechanical behavior of the copper with a high density of nanoscale growth twins.

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Authors and Affiliations

  1. National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, California, USA

    Z. W. Shan & A. M. Minor

  2. Department of Mechanical Engineering, the University of Pittsburgh, Pittsburgh, USA

    Z. W. Shan

  3. Department of Materials Science, the University of California at Berkeley, Berkeley, USA

    A. M. Minor

  4. Institute of Metal Research, Chinese Academy of Science, Shenyang, China

    L. Lu

  5. School of Materials Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana, USA

    E. A. Stach

  6. Department of Mechanical Engineering, University of Pittsburgh, Pittsburgh, Pennyslvania, USA

    S. X. Mao

Authors
  1. Z. W. Shan
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  2. L. Lu
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  3. A. M. Minor
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  4. E. A. Stach
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  5. S. X. Mao
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Shan, Z.W., Lu, L., Minor, A.M. et al. The effect of twin plane spacing on the deformation of copper containing a high density of growth twins. JOM 60, 71–74 (2008). https://doi.org/10.1007/s11837-008-0122-z

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  • DOI: https://doi.org/10.1007/s11837-008-0122-z

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