Skip to main content
SpringerLink
Log in

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

  • Research Summary
  • Lead-Free Solder
  • Published:
JOM Aims and scope Submit manuscript

Abstract

This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. Aforcused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIG-plated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad surface. Results of scanning-electron microscopy/energy-dispersive x-ray analysis of the cross sections and fractured pad surfaces support the suggestion that black pad is the result of galvanic hyper-corosion of the plated electroless nickel by the gold plating bath. Criteria are proposed for diagnosing black pad of ENIG plating.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. C.-Y. Lee and K.-L. Lin, Thin Solid Films (1994) pp. 201–206.

  2. R. Aschenbrenner et al., IEEE Trans. Comp. Packag. Manuf. Technol. Part C, 20 (1997), pp. 95–100.

    Article  Google Scholar 

  3. E. Jung et al, Int. J. Microcircuits Electr. Packag., 20 (1997), pp. 4–11.

    Google Scholar 

  4. Z. Mei et al., Proc. 48th Electr. Comp. Technol. Conf., (Piscataway, NJ: EEE, 1998), pp. 952–961.

    Google Scholar 

  5. F.D.B. Houghton, Circuit World, 26 (2000), pp. 10–16.

    Article  CAS  Google Scholar 

  6. D. Cullen, Proc. IPC National Conf: A Summit on PWB Surface Finish and Solderability (Bannockburn, IL: PC Association, 1998) pp. 44–58.

    Google Scholar 

  7. R.J. Coyle et al., IEEE Trans. Comp. Packag. Technol., 26 (2003), pp. 724–732.

    Article  CAS  Google Scholar 

  8. C.E. Ho, et al, J. Electron. Mater., 29 (2000), pp. 1175–1181.

    Article  CAS  Google Scholar 

  9. C.H. Zhong, et al, Proc 50th Electr. Comp. Technol. Conf., (Piscataway, NJ: EEE, 2000), pp. 151–159.

    Google Scholar 

  10. K. Banerji and E. Bradley, Proc. Surface Mount Technol. Inter, (Edina, MN: SMTA, 1994), pp. 584–595.

    Google Scholar 

  11. E. Bradley and K. Banerji, Proc. 45th Electr. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 1995) pp. 1028–1038.

    Book  Google Scholar 

  12. T.I. Ejim et al., Proc. 21st Inter. Electr. Manuf. Symp. (Piscataway, NJ: IEEE, 1997) pp. 25–31.

    Google Scholar 

  13. Z. Mei, et al., Proc. Pacific Rim/ASME Inter. Intersociety Electr. Photonic Pack. Conf., Adv. Electr. Pack (New York, NY: ASME, 1997), pp. 1543–1550.

    Google Scholar 

  14. P. Johnson et al., Proc. SemiCon West (San Jose, CA: SEMI, 1999), pp. G1–99.

    Google Scholar 

  15. D. Cullen et al., Proc. IPC Works (Bannockburn, IL: IPC Association, 2000), p. S03–2.

    Google Scholar 

  16. G.M. Wenger et al. Proc. 26th Inter. Symp. Testing and Failure Analysis (Materials Park, OH: EDFAS/ASM International, 2000), pp. 355–366.

    Google Scholar 

  17. W.G. Bader, Weld. J. Res. Suppl., 28 (1969), pp. 551s-557s.

    Google Scholar 

  18. P.G. Kim and K.N. Tu, J. Appl. Phys., 80 (1996), pp. 3822–3827.

    Article  CAS  Google Scholar 

  19. J.W. Jang et al., J. Appl. Phys., 85 (1999), pp. 8456–8463.

    Article  CAS  Google Scholar 

  20. P.S. Teo et al., Proc. 50th Electr. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2000), pp. 31–39.

    Google Scholar 

  21. Y.-D. Jeon et al., J. Electron. Mater., 31 (2002), pp. 520–528.

    Article  CAS  Google Scholar 

  22. M.O. Alam et al., J. Appl. Phys., 94 (2003), pp. 4108–4115.

    Article  CAS  Google Scholar 

  23. M. He, et al., Thin Solid Films, 462–463 (2004), pp. 376–383.

    Article  CAS  Google Scholar 

  24. K. Zeng et al., IEEE Trans. Electr. Packag. Manuf., 25 (2002), pp. 162–167.

    Article  CAS  Google Scholar 

  25. Y.-D. Jeon et al., J. Electron. Mater., 32 (2003), pp. 548–557.

    Article  CAS  Google Scholar 

  26. D.-G. Kim et al., Mater. Sci. Eng. B, 121 (2005), pp. 204–210.

    Article  CAS  Google Scholar 

  27. K.C. Hung and Y.C. Chan, J. Mater. Sci. Lett., 19 (2000), pp. 1755–1757.

    Article  CAS  Google Scholar 

  28. K.C. Hung et al., J. Mater. Res. 15 (2000), pp. 2534–2539.

    Article  CAS  Google Scholar 

  29. K. Johal and J. Brewer, Proc. IPC Works Conf. (Bannockburn, IL: IPC Assciation, 2000), p. S03–3.

    Google Scholar 

  30. T.B. Massalski, Binary Alloy Phase Diagrams (Metals Park, OH: ASM International, 1990).

    Google Scholar 

  31. P. Liu et al., Metall. Mater. Trans A., 31 (2000), pp. 2857–2866.

    Google Scholar 

  32. Z. Chen et al., J. Electron. Mater., 33 (2004), pp. 1465–1472.

    Article  CAS  Google Scholar 

  33. H. Matsuki et al., Sci. Tech. Adv. Mater. 3 (2002) pp. 261–270.

    Article  CAS  Google Scholar 

  34. K. Zeng and K.N. Tu, Mater. Sci. Eng. Reports, R38 (2002), pp. 55–105.

    Article  CAS  Google Scholar 

  35. K. Harada et al., Proc. 53rd Electr. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2003), pp. 1731–1737.

    Book  Google Scholar 

  36. C.-W. Hwang et al. J. Mater. Res., 18 (2003), pp. 2540–2543.

    CAS  Google Scholar 

  37. Y.-C. Sohn et al., Proc. 54th Electr. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2004), pp. 75–81.

    Google Scholar 

  38. Y.-C. Sohn and J. Yu, J. Mater. Res. 20 (2005), pp. 1931–1934.

    Article  CAS  Google Scholar 

  39. R. Jay and A. Kwong, Proc. Surface Mount Technol. Inter. (Edina, MN: SMTA, 2001), pp. 372–378.

    Google Scholar 

  40. P. Snugovsky et al. J. Electron. Mater. 30 (2001), pp. 1262–1270.

    CAS  Google Scholar 

  41. S. Anhock et al., Proc. Inter. Symp. Adv. Pack. Mater.: Processes, Properties and Interfaces (Piscataway, NJ: IEEE, 1999), pp. 256–261.

    Book  Google Scholar 

  42. N. Buinno, Proc. Surface Mount Technol. Inter. (Edina, MN: SMTA, 1999), pp. 561–568.

    Google Scholar 

  43. Z. Mei et al., Proc. 49th Electr. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 1999), pp. 125–134.

    Google Scholar 

  44. K. Crouse and D. Cullen PC FAB, Issue 2 (2002).

  45. J.A. Roepsch et al., Proc. Surface Mount Technol. Inter. (Edina, MN: SMTA, 2003), pp. 404–411.

    Google Scholar 

  46. G. Milad and J. Martin, Circuit Tree, Issue 9 (2000).

  47. D. Goyal et al., Proc. 52nd Electr. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2002), pp. 732–739.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Texas Instruments in Dallas, Texas

    Kejun Zeng, Roger Stierman, Don Abbott & Masood Murtuza

Authors
  1. Kejun Zeng
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Roger Stierman
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Don Abbott
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Masood Murtuza
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zeng, K., Stierman, R., Abbott, D. et al. The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating. JOM 58, 75–79 (2006). https://doi.org/10.1007/s11837-006-0187-5

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11837-006-0187-5

Keywords

Search

Navigation