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Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

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Abstract

The interfacial reaction and intermetallic formation at the interface between tin solders containing a small amount of copper with platinum were investigated in this study. Sn-0.7Cu and Sn-1.7Cu solders were reacted with platinum by dipping Pt/Ti/Si specimens into the molten solder at 260°C. Sn-3.8Ag-0.7Cu solder was reacted with platinum by reflowing solder paste on a Pt/Ti/Si substrate at 250°C. PtSn4 intermetallic formed in all specimens while Cu6Sn5 interfacial intermetallic was not observed at the solder/platinum interfaces in any specimens. A parabolic relationship existed between the thickness of the Pt-Sn intermetallic and reaction time, which indicates the intermetallic formation in the solder/platinum interface is diffusion controlled.

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Authors and Affiliations

  1. the Department of Materials Engineering at Hanyang University, Seoul, Korea

    Tae Hyun Kim (a graduate student) & Young-Ho Kim (professor)

Authors
  1. Tae Hyun Kim
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  2. Young-Ho Kim
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Additional information

For more information, contact Young-Ho Kim, Hanyang University, Department of Materials Engineering, Seoul, 133-791, Korea; e-mail kimyh@hanyang.ac.kr.

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Kim, T.H., Kim, YH. Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum. JOM 56, 45–49 (2004). https://doi.org/10.1007/s11837-004-0111-9

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  • DOI: https://doi.org/10.1007/s11837-004-0111-9

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