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Multi-spectral and hyperspectral image fusion using 3-D wavelet transform

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Journal of Electronics (China)

Abstract

Image fusion is performed between one band of multi-spectral image and two bands of hyperspectral image to produce fused image with the same spatial resolution as source multi-spectral image and the same spectral resolution as source hyperspectral image. According to the characteristics and 3-Dimensional (3-D) feature analysis of multi-spectral and hyperspectral image data volume, the new fusion approach using 3-D wavelet based method is proposed. This approach is composed of four major procedures: Spatial and spectral resampling, 3-D wavelet transform, wavelet coefficient integration and 3-D inverse wavelet transform. Especially, a novel method, Ratio Image Based Spectral Resampling (RIBSR) method, is proposed to accomplish data resampling in spectral domain by utilizing the property of ratio image. And a new fusion rule, Average and Substitution (A&S) rule, is employed as the fusion rule to accomplish wavelet coefficient integration. Experimental results illustrate that the fusion approach using 3-D wavelet transform can utilize both spatial and spectral characteristics of source images more adequately and produce fused image with higher quality and fewer artifacts than fusion approach using 2-D wavelet transform. It is also revealed that RIBSR method is capable of interpolating the missing data more effectively and correctly, and A&S rule can integrate coefficients of source images in 3-D wavelet domain to preserve both spatial and spectral features of source images more properly.

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Authors and Affiliations

  1. School of Electronics and Information, Shaanxi Key Laboratory of Information Acquisition and Processing, Northwestern Polytechnical University, Xi’an, 710072, China, P. O. Box 612

    Zhang Yifan (female, Ph.D. candidate) & He Mingyi

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  1. Zhang Yifan
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  2. He Mingyi
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Correspondence to Zhang Yifan.

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Zhang, Y., He, M. Multi-spectral and hyperspectral image fusion using 3-D wavelet transform. J. of Electron.(China) 24, 218–224 (2007). https://doi.org/10.1007/s11767-005-0232-5

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  • DOI: https://doi.org/10.1007/s11767-005-0232-5

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