Skip to main content
Log in

Diffusion and Atomic Mobilities in fcc Ni-Sn Alloys

  • Basic and Applied Research
  • Published:
Journal of Phase Equilibria and Diffusion Aims and scope Submit manuscript

Abstract

The composition-distance profiles in face-centered cubic (fcc) Ni-Sn alloys at 1173, 1223, 1273, and 1323 K were measured by means of electronic probe microanalysis (EPMA) using Ni/Ni-7.3at.%Sn diffusion couples. Based on the available thermodynamic information and various experimental diffusion coefficients, the atomic mobilities of Ni and Sn in fcc Ni-Sn alloys were assessed as a function of temperature and composition in terms of the CALPHAD method using the DICTRA® software package. Optimized mobility parameters are presented. Comparisons between the calculated and measured diffusion coefficients show that most of the experimental information can be reproduced reasonably. The obtained mobility parameters can also predict satisfactorily the composition-distance profiles of the Ni/Ni-7.3at.%Sn diffusion couples determined in the present work.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  1. M.M. Abtewa and G. Selvadurayb, Lead-free Solders in Microelectronics, Mater. Sci. Eng. R, 2000, 27, p 95-141

    Article  Google Scholar 

  2. K. Zeng and K.N. Tu, Six Cases of Reliability Study of Pb-free Solder Joints in Electronic Packaging Technology, Mater. Sci. Eng. R, 2002, 38, p 55-105

    Article  Google Scholar 

  3. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, Properties of Lead-free Solder Alloys with Rare Earth Element Additions, Mater. Sci. Eng. R, 2004, 44, p 1-44

    Article  Google Scholar 

  4. Y. Li and C.P. Wang, Recent Advances of Conductive Adhesives as a Lead-free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications, Mater. Sci. Eng. R, 2006, 51, p 1-35

    Article  Google Scholar 

  5. K.N. Tu and K. Zeng, Tin-Lead (SnPb) Solder Reaction in Flip Chip Technology, Mater. Sci. Eng. R, 2001, 34, p 1-58

    Article  Google Scholar 

  6. G. Ghosh, Dissolution and Interfacial Reactions of Thin-film Ti/Ni/Ag Metallizations in Solder Joints, Acta Mater., 2001, 49, p 2609-2624

    Article  Google Scholar 

  7. C.Y. Liu, C. Chen, A.K. Mal, and K.N. Tu, Direct Correlation Between Mechanical Failure and Metallurgical Reaction in Flip Chip Solder Joints, J. Appl. Phys., 1999, 85, p 3882-3886

    Article  ADS  Google Scholar 

  8. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan, Current-Crowding-Induced Electromigration Failure in Flip Chip Solder Joints, Appl. Phys. Lett., 2002, 80, p 580-582

    Article  ADS  Google Scholar 

  9. C.-M. Chen and S.-W. Chen, Electromigration Effect Upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures, Acta Mater., 2002, 50, p 2461-2469

    Article  Google Scholar 

  10. M. Mita, M. Kajihara, N. Kurokawa, and K. Sakamoto, Growth Behavior of Ni3Sn4 Layer During Reactive Diffusion Between Ni and Sn at Solid-State Temperatures, Mater. Sci. Eng. A, 2005, 403, p 269-275

    Article  Google Scholar 

  11. J. Wang, H.S. Liu, L.B. Liu, and Z.P. Jin, Interfacial Reaction Between Sn-Bi Alloy and Ni Substrate, J. Electron. Mater., 2006, 35, p 1842-1847

    Article  ADS  Google Scholar 

  12. S.-W. Chen, C.-C. Chen, and C.-H, Chang, Microstructural Evolution of Sn-rich Au-Sn/Ni Flip-Chip Solder Joints Under High Temperature Storage Testing Conditions, Scripta Mater., 2007, 56, p 661-664

    Article  Google Scholar 

  13. J. Wang, H.S. Liu, L.B. Liu, and Z.P. Jin, Interfacial Reaction Between Sn-Ag Alloys and Ni Substrate, J. Alloys Compd., 2008, 455, p 159-163

    Article  Google Scholar 

  14. T. Laurila, V. Vuorinen, and J.K. Kivilahti, Interfacial Reactions Between Lead-Free Solders and Common Base Materials, Mater. Sci. Eng. R, 2005, 49, p 1-60

    Article  Google Scholar 

  15. K. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, and K.N. Tu, Kirkendall Void Formation in Eutectic SnPb Solder Joints on Bare Cu and its Effect on Joint Reliability, J. Appl. Phys., 2005, 97, p 024508

    Article  ADS  Google Scholar 

  16. A.B. Vladimirov, V.N. Kaygorodov, S.M. Klotsman, and I.S. Trakhtenberg, Volume Diffusion of ‘Silver’ Impurities in Nickel, Phys. Met. Metall., 1979, 48, p 107-113

    Google Scholar 

  17. D. Marchive, D. Duc, D. Treheux, and P. Guiraldenq, Bulk and Grain-Boundaries Diffusion of Sn in 18-10 Austenitic Stainless-Steel: Study of Ferritization Process at High Temperature, C. R. Acad. Sci., Paris, 1975, 280, p 25-28

    Google Scholar 

  18. Y. Iijima, K. Hoshino, M. Kikuchi, and K. Hirano, Interdiffusion and Self-diffusion in Nickel-rich Nickel-Tin Alloys, Trans. Jpn. Inst. Met., 1984, 25, p 234-243

    Google Scholar 

  19. L. Kaufman and H. Bernstein, Computer Calculation of Phase Diagrams, Academic Press, New York, 1970

    Google Scholar 

  20. B. Sundman, B. Jansson, and J.-O. Andersson, The Program for Optimization, CALPHAD, 1985, 9, p 153-190

    Article  Google Scholar 

  21. J.-O. Andersson, L. Höglund, B. Jönsson, and J. Ågren, Computer Simulation of Multicomponent Diffusional Transformations in Steel, Fundamentals and Applications of Ternary Diffusion, G.R. Prudy, Ed., Pergamon Press, New York, 1990, p 153-163

    Google Scholar 

  22. J.-O. Andersson and J. Ågren, Models for Numerical Treatment of Multicomponent Diffusion in Simple Phases, J. Appl. Phys., 1992, 72, p 1350-1355

    Article  ADS  Google Scholar 

  23. A. Borgenstam, A. Engström, L. Höglund, and J. Ågren, DICTRA, A Tool for Simulation of Diffusional Transformations in Alloys, J. Phase Equil., 2000, 21, p 269-280

    Article  Google Scholar 

  24. J.E. Morral, B.M. Dupen, and C.C. Law, Application of Commercial Computer Codes to Modeling the Carburizing Kinetics of Alloy Steels, Metall. Mater. Trans. A, 1992, 23A, p 2069-2073

    ADS  Google Scholar 

  25. A. Engström, L. Höglund, and J. Ågren, Computer Simulation of Diffusion in Multiphase System, Metall. Mater. Trans. A, 1994, 25A, p 1127-1134

    Article  ADS  Google Scholar 

  26. U.R. Kattner, W.J. Boettinger, and S.R. Coriell, Application of Lukas’ Phase Diagram Programs to Solidification Calculations of Multicomponent Alloys, Z. Metallkd., 1996, 87, p 522-528

    Google Scholar 

  27. B.-J. Lee, Numerical Simulation of Diffusional Reactions Between Multiphase Alloys with Different Matrix Phases, Scripta Mater., 1999, 40, p 573-579

    Article  Google Scholar 

  28. Y. Du and J.C. Schuster, An Effective Approach to Describe Growth of Binary Intermediate Phases with Narrow Ranges of Homogeneity, Metall. Mater. Trans. A, 2001, 32A, p 2396-2400

    Article  Google Scholar 

  29. L. Zhang, Y. Du, Y. Ouyang, H. Xu, X.-G. Lu, Y. Liu, Y. Kong, and J. Wang, Atomic Mobilities, Diffusivities and Simulation of Diffusion Growth in the Co-Si System, Acta Mater., 2008, 56, p 3940-3950

    Article  Google Scholar 

  30. B. Jönsson, Ferromagnetic Ordering and Diffusion of Carbon and Nitrogen in bcc Cr-Fe-Ni Alloys, Z. Metallkd., 1994, 85, p 498-501

    Google Scholar 

  31. B. Jönsson, Assessment of the Mobility of Carbon in fcc C-Cr-Fe-Ni Alloys, Z. Metallkd., 1994, 85, p 502-509

    Google Scholar 

  32. B. Jönsson, On Ferrromagnetic Ordering and Lattice Diffusion-A simple model, Z. Metallkd., 1992, 83, p 349-355

    Google Scholar 

  33. O. Redlich and A. Kister, Algebraic Representation of Thermodynamic Properties and the Classification of Solutions, Ind. Eng. Chem., 1948, 40, p 345-348

    Article  Google Scholar 

  34. H.S. Liu, J. Wang, and Z.P. Jin, Thermodynamic Optimization of the Ni-Sn Binary System, CALPHAD, 2005, 28, p 363-370

    Article  Google Scholar 

  35. B. Jönsson, Assessment of the Mobilities of Cr, Fe and Ni in Binary fcc Cr-Fe and Cr-Ni Alloys, Scand. J. Metall., 1995, 24, p 21-27

    Google Scholar 

  36. J. Wang, C. Leinenbach, H.S. Liu, L.B. Liu, M. Roth, and Z.P. Jin, Re-assessment of Diffusion Mobilities in the Face-Centered Cubic Cu-Sn Alloys, CALPHAD, 2009, 33, p 704-710

    Article  Google Scholar 

Download references

Acknowledgments

This work was financially supported by National Science Foundation of China (Grant No. 50371104, 50671122). The authors J. Wang, H.S. Liu, L.B. Liu, and Z.P. Jin would like to thank Mr. S.T. Li, Shan-Dong University, for his assistance in EPMA.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to J. Wang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Wang, J., Leinenbach, C., Liu, H.S. et al. Diffusion and Atomic Mobilities in fcc Ni-Sn Alloys. J. Phase Equilib. Diffus. 31, 28–33 (2010). https://doi.org/10.1007/s11669-009-9607-x

Download citation

  • Received:

  • Revised:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11669-009-9607-x

Keywords

Navigation