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Ultrahigh Strength Copper Obtained by Surface Mechanical Attrition Treatment at Cryogenic Temperature

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Abstract

The purpose of this paper is to investigate the effect of dynamic recovery on the mechanical properties of copper (Cu) during surface mechanical attrition treatment (SMAT) at both room temperature (RT) and cryogenic temperature (CT). Copper sheets were processed by SMAT at RT and at CT for 5, 15, and 30 min, respectively. The Cu samples after SMAT at RT for 30 min exhibited better ductility but lower strength than the samples after SMAT at CT for 30 min due to dynamic recovery. X-ray diffraction analysis indicated that decreasing temperature during SMAT led to an increase in the twin and dislocation densities. In addition, a thicker gradient structure layer with finer grains was obtained in the SMAT-processed Cu samples at CT than at RT. The results indicated that SMAT at CT can effectively suppress the occurring of dynamic recovery and produce ultrahigh strength pure copper without seriously sacrificing its ductility.

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Acknowledgments

The authors wish to acknowledge the financial support from the National Natural Science Foundation of China (Grant Nos. 51561015 and 51361017). We also greatly appreciate prof. Y. T. Zhu from North Carolina State University for supporting this research.

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Authors and Affiliations

  1. Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, Yunnan, 650093, China

    Yu Shen, Xincheng Yang, Yanzhao Pang, Lele Sun & Xinkun Zhu

  2. School of Aerospace, Mechanical and Manufacturing Engineering, RMIT University, Bundoora, VIC, 3083, Australia

    Cuie Wen

  3. Faculty of Science, Kunming University of Science and Technology, Kunming, Yunnan, 650093, China

    Jingmei Tao & Yulan Gong

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  1. Yu Shen
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Correspondence to Xinkun Zhu.

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Shen, Y., Wen, C., Yang, X. et al. Ultrahigh Strength Copper Obtained by Surface Mechanical Attrition Treatment at Cryogenic Temperature. J. of Materi Eng and Perform 24, 5058–5064 (2015). https://doi.org/10.1007/s11665-015-1797-2

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  • DOI: https://doi.org/10.1007/s11665-015-1797-2

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