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Improved Thermal Property of a Multilayered Graphite Nanoplatelets Filled Silicone Resin Composite

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Abstract

We produced graphite nanoplatelets (GNP)/silicone resin composites at various loadings. The utilized GNPs were characterized by two-dimensional structure with high aspect ratio (~1810), and the GNP with approximately 10-30 nm thickness and 10-50 µm in length evenly dispersed throughout the resin matrix, which enables that GNPs effectively act as thermally conductive medium, thus contributed considerably to the formation of an efficient three-dimensional network for heat flow. The thermal conductivities of 5, 10, 15, and 20 wt.% GNP composite were 0.35, 1.02, 1.32, and 2.01 W/(m K), and were ca. 0.9, 4.7, 6.3, and 10.2 times higher than that of silicone resin at room temperature, respectively. The thermal conductivity decreased with elevated temperature in 25-200 °C, which was reminiscent at higher loading. Differential scanning calorimeter analysis showed that GNP addition increased the curing temperature of silicone resin from 90 to 119 °C, probably by hindering the free movement (mobility) of the silicone chains. The result showed that the GNP not only reduced the CTE but also improved the thermal stability of composite simultaneously.

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Acknowledgments

This work is supported by the National Natural Science Foundation of China (No. 51276044), the Guangdong Provincial Natural Science Foundation of China (Nos. 9251009001000006, S2013010015994).

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Authors and Affiliations

  1. School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China

    Jin Lin, Haiyan Zhang, Muyao Tang, Wenying Tu & Xiubin Zhang

  2. Guangdong Provincial Key Laboratory of Functional Soft Condensed Matter, Guangdong University of Technology, Guangzhou, 510006, China

    Haiyan Zhang

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Correspondence to Haiyan Zhang.

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Lin, J., Zhang, H., Tang, M. et al. Improved Thermal Property of a Multilayered Graphite Nanoplatelets Filled Silicone Resin Composite. J. of Materi Eng and Perform 24, 920–929 (2015). https://doi.org/10.1007/s11665-014-1356-2

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  • DOI: https://doi.org/10.1007/s11665-014-1356-2

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