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Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

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Abstract

The growth behavior of reaction-formed intermetallic compounds (IMCs) at Sn3.5Ag0.5Cu/Ni and Cu interfaces under thermal-shear cycling conditions was investigated. The results show that the morphology of (Cu x Ni1–x )6Sn5 and Cu6Sn5 IMCs formed both at Sn3.5Ag0.5Cu/Ni and Cu interfaces gradually changed from scallop-like to chunk-like, and different IMC thicknesses developed with increasing thermal-shear cycling time. Furthermore, Cu6Sn5 IMC growth rate at the Sn3.5Ag0.5Cu/Cu interface was higher than that of (Cu x Ni1–x )6Sn5 IMC under thermal-shear cycling. Compared to isothermal aging, thermal-shear cycling led to only one Cu6Sn5 layer at the interface between SnAgCu solder and Cu substrate after 720 cycles. Moreover, Ag3Sn IMC was dispersed uniformly in the solder after reflow. The planar Ag3Sn formed near the interface changed remarkably and merged together to large platelets with increasing cycles. The mechanism of formation of Cu6Sn5, (Cu x Ni1–x )6Sn5 and Ag3Sn IMCs during thermal-shear cycling process was investigated.

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References

  1. J.Y. Tsai and C.R. Kao, The Effect of Ni on the Interfacial Reaction Between Sn-Ag Solder and Cu Metallization, Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference (Taiwan, China), IEEE Press, 2002, p 271–276

  2. Y. S. Kim, K.S. Kim, C.W. Hwang, et.al. (2003)Effect of compositipm and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys J. Alloys and Compd., 352(3):237–245.

    Article  CAS  MathSciNet  Google Scholar 

  3. X. Ma, F.J. Wang, Y.Y. Qian, et.al. Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface Materials Letters, 2003, 57(22-23): 3361-3365.

    Article  CAS  Google Scholar 

  4. K.S. Kim, J.M. Yang, C.H. Yu, I.O. Jung, et.al. Analysis on interfacial reactions between Sn-Zn solders and the Au/Ni electrolytic-plated Cu pad. J. Alloys and Compd. (2004) 379(1/2): 314-318.

    Article  CAS  Google Scholar 

  5. C.L. Wei and C.R. Kao, Liquid/Solid and Solid/Solid Reactions Between SnAgCu Lead-Free Solders and Ni Surface Finish, Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference (Taiwan, China), IEEE Press, 2002, p 330–334

  6. C.M. Chang, P.C. Shi, and K.L. Lin, Interfacial Reaction Between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge Lead-Free Solders and Metallic Substrates, Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference (Taiwan, China), IEEE Press, 2002, p 360–366

  7. H.L.J. Pang, K.H. Tan, X.Q. Shi, and Z.P. Wang, Microstructure and Intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging. Mat. Sci. Eng. A-struct 307 (2001) 42-50.

    Article  Google Scholar 

  8. Ahmed Sharif, Y.C.Chan, M.N.Islam, M.J.Rizvi. Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization. J. Alloys and Compd. 388 (2005) 75-82.

    Article  CAS  Google Scholar 

  9. S. Wiese, F. Feustel, E. Meusel, Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints. Sensors and Actuators A99 (2002) 188-193.

    Article  Google Scholar 

  10. K.H. Prakash, T. Sritharan. Interface reaction between copper and molten tin-lead solders. Acta mater. 49 (2001): 2481-2489.

    Article  CAS  Google Scholar 

  11. O. Fouassier, J. Chazelas, J.F. Silvain. Conception of a consumable copper reaction zone for a NiTi/SnAgCu. Composite Material. Part A, 2002 (33): 1391-1395.

    Google Scholar 

  12. L. Qin, J. Zhao, L. Wang. et.al. Microstructure evolution in lead-free solder joints after wave soldering and reflow soldering. Electronic Process Technology 2004,25(2):64-67.

    CAS  Google Scholar 

  13. H.L.J. Pang, T.H. Low, B.S. Xiong, et.al. Thermal cycling aging effects on Sn-Ag-Cu solder joint microstucture, IMC and strength. Thin Solid Films 462-463(2004): 370-375.

    Article  Google Scholar 

  14. I. Dutta, D. Pan. R.A. Marks, et.al. Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders. Materials Science and Engineering A, 2005, 410-411(25):48-52.

    Google Scholar 

  15. J. Zhao, Y.Miyashita, Y.Mutoh. Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder. International Journal of Fatigue, 2001(23): 723-731.

    Article  CAS  Google Scholar 

  16. D.W. Henderson, T. Gosselin, A. Sarkhel. Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys. J. Mater. Res. 17 (2002): 2775-2778.

    Article  CAS  ADS  Google Scholar 

  17. K.S.Kim, S.H.Huh, K.Suganuma. Effect of intermetallic compounds on properties if Sn-Ag-Cu lead-free soldered joints. J. Alloys and Compd., 2003(352): 226-236.

    Article  CAS  Google Scholar 

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Acknowledgment

This work was supported by the National Natural Science Foundation of China (No. 50371010).

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, 30# Xueyuan R.d., Haidian District, Beijing, P.R. China

    Lihua Qi, Jihua Huang, Hua Zhang, Xingke Zhao, Haitao Wang & Donghai Cheng

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  1. Lihua Qi
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  2. Jihua Huang
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  3. Hua Zhang
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  5. Haitao Wang
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Correspondence to Lihua Qi.

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Qi, L., Huang, J., Zhang, H. et al. Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces. J. of Materi Eng and Perform 19, 129–134 (2010). https://doi.org/10.1007/s11665-009-9423-9

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  • DOI: https://doi.org/10.1007/s11665-009-9423-9

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