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Comparison of GRCop-84 to Other Cu Alloys with High Thermal Conductivities

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Abstract

The mechanical properties of six highly conductive copper alloys, GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z were compared. Tests were done on as-received hard drawn material, and after a heat treatment designed to simulate a brazing operation at 935 °C. In the as-received condition AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, and Cu-0.9Cr had excellent strengths at temperatures below 500 °C. However, the brazing heat treatment substantially decreased the mechanical properties of AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z. The properties of GlidCop Al-15 and GRCop-84 were not significantly affected by the heat treatment. Thus there appear to be advantages to GRCop-84 over AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z if use or processing temperatures greater than 500 °C are expected. Ductility was the lowest in GlidCop Al-15 and Cu-0.9Cr; reduction in area was particularly low in GlidCop Al-15 above 500 °C, and as-received Cu-0.9Cr was brittle between 500 and 650 °C. Tensile creep tests were done at 500 and 650 °C; the creep properties of GRCop-84 were superior to those of brazed AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z. In the brazed condition, GRCop-84 was superior to the other alloys due to its greater strength and creep resistance (compared to AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z) and ductility (compared to GlidCop Al-15).

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Acknowledgments

We would like to praise and acknowledge the dedicated support of our technicians and machine shop personnel: John Zoha, Sharon Thomas, Bill Armstrong, John Juhas, Adrienne Veverka, Ronald Phillips, Dave Brinkman, Aldo Panzanella, and Tim Ubienski; as well as our furnace/heat treat engineer Mark Jaster. Their support has enabled timely progress on this effort.

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Correspondence to Henry C. de Groh III.

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de Groh, H.C., Ellis, D.L. & Loewenthal, W.S. Comparison of GRCop-84 to Other Cu Alloys with High Thermal Conductivities. J. of Materi Eng and Perform 17, 594–606 (2008). https://doi.org/10.1007/s11665-007-9175-3

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  • DOI: https://doi.org/10.1007/s11665-007-9175-3

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