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Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints

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Abstract

The effects of phase coarsening in 63Sn37Pb solder joints produced by isothermal annealing and during thermo-mechanical cycling (TMC) on the fatigue cracked area growth rate dAc/dN were investigated. The phase coarsening by isothermal annealing was in accord with the mechanism of interphase boundary diffusion; that during TMC was significantly greater than by isothermal annealing. The phase coarsening in the range considered (D=1–5 µm, N<150 cycles) had only little, if any, influence on dAc/dN, which occurred mainly in Stage I of the fatigue crack growth rate regime. Results obtained previously, however, indicate that for N>150 cycles dAc/dN is significantly decreased by a reduction in the as-reflowed phase size. Reasonable agreement occurred between the calculated fatigue lifetime vs initial as-reflowed phase size and that measured.

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Authors and Affiliations

  1. Materials Science and Engineering Department, North Carolina State University, 27695-7907, Raleigh, NC

    P. L. Hacke, Y. Fahmy & H. Conrad

Authors
  1. P. L. Hacke
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  2. Y. Fahmy
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  3. H. Conrad
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Hacke, P.L., Fahmy, Y. & Conrad, H. Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints. J. Electron. Mater. 27, 941–947 (1998). https://doi.org/10.1007/s11664-998-0125-0

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  • DOI: https://doi.org/10.1007/s11664-998-0125-0

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