Abstract
Amorphous titanium nitride (TiN) thin films have been prepared on silicon (Si) and glass substrates by direct-current (DC) reactive magnetron sputtering with a supported discharge (triode). Nitrogen gas (N2) at partial pressure of 0.3 Pa, 0.4 Pa, 0.5 Pa, and 0.6 Pa was used to prepare the TiN thin films, maintaining total pressure of argon and N2 of about 0.7 Pa. The chemical, microstructural, optical, and electrical properties of the TiN thin films were systematically studied. Presence of different phases of Ti with nitrogen (N), oxygen (O2), and carbon (C) elements was revealed by x-ray photoelectron spectroscopy characterization. Increase in the nitrogen pressure from 0.3 Pa to 0.6 Pa reduced the optical bandgap of the TiN thin film from 2.9 eV to 2.7 eV. Photoluminescence study showed that TiN thin film deposited at N2 partial pressure of 0.3 Pa exhibited three shoulder peaks at 330 nm, 335 nm, and 340 nm, which disappeared when the sample was deposited with N2 partial pressure of 0.6 Pa. Increase in the nitrogen content decreased the electrical resistivity of the TiN thin film from 3200 μΩ cm to 1800 μΩ cm. Atomic force microscopy studies of the TiN thin films deposited with N2 partial pressure of 0.6 Pa showed a uniform surface pattern associated with accumulation of fine grains. The results and advantages of this method of preparing TiN thin films are also reported.
Similar content being viewed by others
References
G. Martinez, V. Shutthanandan, S. Thevuthasan, J.F. Chessa, and C.V. Ramana, Ceram. Int. 40, 5757 (2014).
A. Emmanuel, G.A. Osinkolu, A.Y. Fasasi, D.A. Pelemo, and E.I. Obiajunwa, J Mater. Sci. Mater. Electron. 27, 335 (2016).
F. Battegay and F. Hodaj, J Mater. Sci. Mater. Electron. 27, 1679 (2016).
B. Subramanian, R. Ananthakumar, V.S. Vidhya, and M. Jayachandran, Mater. Sci. Eng. 176, 1 (2011).
N. Arshi, J. Lu, Y.K. Joo, C.G. Lee, J.H. Yoon, and F. Ahmed, J Mater. Sci. Mater. Electron. 24, 1194 (2013).
X. Lin, G. Zhao, W. Liqing, G. Duan, and G. Han, J. Alloys Compd. 502, 195 (2010).
N. White, A.L. Campbell, J.T. Grant, R. Pachter, K. Eyink, R. Jakubiak, G. Martinez, and C.V. Raman, Appl. Surf. Sci. 292, 74 (2014).
K. Yokota, K. Nakamura, T. Kasuya, K. Mukai, and M. Ohnishi, J. Phys. D 37, 1095 (2004).
S. Shayestehaminzadeh, T.K. Tryggvason, F. Magnus, S. Olafsson, and J.T. Gudmundsson, Thin Solid Films 549, 199 (2013).
N. Madaoui, N. Saoula, B. Zaid, D. Saidi, and A. Si Ahmed, Appl. Surf. Sci. 312, 134 (2014).
Y.-K. Lee, J.-Y. Kim, Y.-K. Lee, M.-S. Lee, D.-K. Kim, D.-Y. Jin, T.-H. Namc, H.-J. Ahn, and D.-K. Park, J. Cryst. Growth 234, 498 (2002).
D.M. Devia, E. Restrepo-Parra, P.J. Arango, A.P. Tschiptschin, and J.M. Velez, Appl. Surf. Sci. 257, 6181 (2011).
D.R. Irala, L.C. Fontana, J.C. Sagas, and H.S. Maciel, Surf. Coat. Tech. 240, 154 (2014).
A. Kavitha, R. Kannan, P. Sreedhara Reddy, and S. Rajashabala, J Mater. Sci. Mater. Electron. 27, 10427 (2016).
P. Saikia and B. Kakati, J. Vac. Sci. Technol., A 31, 061307 (2013).
M.S.R.N. Kiran, M. Ghanashyam Krishna, and K.A. Padmanabhan, Appl. Surf. Sci. 255, 1934 (2008).
K. Vasu, M. Ghanashyam Krishna, and K.A. Padmanabhan, Appl. Surf. Sci. 257, 3069 (2011).
H.Z. Wu, T.C. Chou, A. Mishra, and S.C. Gujrathi, Thin Solid Films 191, 55 (1990).
S. Niyomsoan, W. Grant, D.L. Olson, and B. Mishra, Thin Solid Films 415, 187 (2002).
P. LeClair, G.P. Berera, and J.S. Moodera, Thin Solid Films 376, 9 (2000).
P. Saikia, A. Joseph, R. Rane, B.K. Saikia, and S. Mukherjee, J. Theor. Appl. Phys. 7, 66 (2013).
S. Omveer, R.P. Dahiya, H.K. Malik, P. Kumar, and V. Singh, Appl. Sci. Lett. 2, 37 (2016).
S.O.H. Yatt, B.S. Chao, and H. Yamauchi, J. Mater. Sci.: Mater. Electron. 3, 41 (1992).
N.K. Ponon, D.J. Appleby, E. Arac, P.J. King, S. Ganti, K.S. Kwa, and A. O’Neill, Thin Solid Films 578, 31 (2015).
Author information
Authors and Affiliations
Corresponding authors
Rights and permissions
About this article
Cite this article
Kavitha, A., Kannan, R., Gunasekhar, K.R. et al. Effect of Nitrogen Content on Physical and Chemical Properties of TiN Thin Films Prepared by DC Magnetron Sputtering with Supported Discharge. J. Electron. Mater. 46, 5773–5780 (2017). https://doi.org/10.1007/s11664-017-5608-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-017-5608-4