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Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder

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Abstract

Recently, we detected length-dependent electromigration (EM) behavior in Sn-58Bi (SB) solder and revealed the existence of Bi back-flow, which retards EM-induced Bi segregation and is dependent on solder length. The cause of the back-flow is attributed to an oxide layer formed on the SB solder. At present, underfill (UF) material is commonly used in flip-chip packaging as filler between chip and substrate to surround solder bumps. In this study, we quantitatively investigated the effect of UF material as a passivation layer on EM in SB solder strips. EM tests on SB solder strips with length of 50 μm, 100 μm, and 150 μm were conducted simultaneously. Some samples were coated with commercial thermosetting epoxy UF material, which acted as a passivation layer on the Cu–SB–Cu interconnections. The value of the critical product for SB solder was estimated to be 38 A/cm to 43 A/cm at 353 K to 373 K without UF coating and 59 A/cm at 373 K with UF coating. The UF material acting as a passivation layer suppressed EM-induced Bi segregation and increased the threshold current density by 37% to 55%. However, at very high current density, this effect became very slight. In addition, Bi atoms can diffuse to the anode side through the Sn phase, hence addition of microelements to the Sn phase to form obstacles, such as intermetallic compounds, may retard Bi segregation in SB solder.

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Acknowledgements

The authors acknowledge Prof. Masumi Saka at Tohoku University for valuable discussion. This work was supported by JSPS KAKENHI Grant Nos. JP15K17931, JP26289001, and JP15H03887.

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Authors and Affiliations

  1. Department of Systems Design Engineering, Akita University, 1-1 Tegatagakuen-machi, Akita, 010-8502, Japan

    Xu Zhao & Mikio Muraoka

  2. Department of Mechanical Engineering, Akita University, Akita, Japan

    Satoshi Takaya

Authors
  1. Xu Zhao
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  2. Satoshi Takaya
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  3. Mikio Muraoka
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Correspondence to Xu Zhao.

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Zhao, X., Takaya, S. & Muraoka, M. Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder. J. Electron. Mater. 46, 4999–5006 (2017). https://doi.org/10.1007/s11664-017-5507-8

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  • DOI: https://doi.org/10.1007/s11664-017-5507-8

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