Abstract
The traditional ball shear test is not suitable for evaluating joint reliability under drop loading, since the applied test speeds, usually lower than 5 mm/s, are well below the impact velocity applied to the solder joint in a drop test. The present study expands recently reported research by investigating the effect of thermal aging on the joint strength and fracture mode of Sn-3.0Ag-0.5Cu ball grid arrays during high-speed shear testing, with a shear height of 50 μm and a shear speed ranging from 0.01 m/s to 3 m/s. The test specimens were aged at 393 K for 1000 h. After reflow, a (Ni,Cu)3Sn4 intermetallic compound (IMC) layer was observed at the solder/Ni-P interface and the thickness of the IMC layer was increased through the aging process. The shear strength increased with increasing shear speed. The fracture surface of the solder joints showed three different fracture modes according to the shear speed and aging time. The fracture mode changed from ductile fracture to brittle fracture with increasing shear speed.
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References
A.R. Zbrzezny, P. Snugovsky, and D.D. Perovic, Microelectron. Reliab. 47, 2205 (2007).
Y.S. Lai, P.F. Yang, and C.L. Yeh, Microelectron. Reliab. 46, 645 (2006).
E.H. Wong, R. Rajoo, S.K.W. Seah, C.S. Selvanayagam, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owen, L.C. Tan, M. Leoni, P.L. Eu, Y.-S. Lai, and C.-L. Yeh, Microelectron. Reliab. 48, 1069 (2008).
Y.S. Lai, P.C. Yang, C.L. Yeh, and T.H. Wang, Proceedings of the 38th International Symposium Microelectronics (Philadelphia: IEEE, 2005), pp. 199–205.
C. Birzer, B. Rakow, R. Steiner, and J. Walter, Proceedings of the 7th Electronic Packaging Technology Conference (Singapore: IEEE, 2005), pp. 255–261.
D.Y.R. Chong, F.X. Che, J.H.L. Pang, K. Ng, J.Y.N. Tan, and P.T.H. Low, Microelectron. Reliab. 46, 1160 (2006).
F. Song, S.W. Ricky Lee, K. Newman, B. Sykes, and S.␣Clark, Proceedings of the 2007 Electronic Components and Technology Conference (Reno: IEEE, 2007), pp. 364–372.
E. Kaulfersch, S. Rzepka, V. Ganeshan, A. Muller, and B. Michel, Proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems (London: IEEE, 2007), pp. 1–4.
B. Zhao, B. An, F.S. Wu, and Y.P. Wu, Proceedings of the 7th International Conference on Electronics Packaging Technology (Shanghai: IEEE, 2006), pp. 1–5.
C.L. Yeh, Y.S. Lai, H.C. Chang, and T.H. Chen, Microelectron. Reliab. 47, 1127 (2007).
JESD22-B117A, JEDEC Solid State Technology Association, 2006.
J.W. Kim and S.B. Jung, Int. J. Solids Struct. 43, 1928 (2006).
J.W. Kim and S.B. Jung, Mater. Sci. Eng. A 371, 267 (2004).
J.W. Kim, D.G. Kim, and S.B. Jung, Microelectron. Reliab. 46, 535 (2006).
Y.D. Jeon, S. Nieland, A. Ostmann, H. Reichl, and K.W. Paik, J. Electron. Mater. 32, 548 (2003).
C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 31, 584 (2002).
G.E. Dieter, Mechanical Metallurgy (New York: McGraw-Hill, 1988).
A. Nadai, Theory of Flow and Fracture of Solids (New York: McGraw-Hill, 1950).
G.R. Johnson and W.H. Cook, Proceedings of 7th International Symposium on Ballistics (Hague: Technomic. Pub. Co., 1983), pp. 541–549.
F.J. Zerilli and R.W. Armstrong, J. Appl. Phys. 61, 1816 (1987).
S.R. Bodner and Y.J. Partom, J. Appl. Mech. 42, 385 (1975).
P.S. Symmonds, Behaviour of Materials under Dynamic Loading (New York: ASME, 1965).
J.W. Kim, J.W. Yoon, and S.B. Jung, Mater. Sci. Forum 449, 897 (2004).
J.M. Koo and S.B. Jung, Microelectron. Reliab. 47, 2169 (2007).
J.W. Jang, P.D. Ananda, E.D. James, L.P. Steve, L.O. Norman, J.K. Lin, and R.F. Darrel, IEEE Trans. Electron. Packag. Manuf. 30, 49 (2007).
T.T. Mattila and J.K. Kivilahti, J. Electron. Mater. 34, 969 (2005).
Y.H. Xia, C.Y. Lu, and X.M. Xie, J. Electron. Mater. 36, 1129 (2007).
W. Peng and M.E. Marques, J. Electron. Mater. 36, 1679 (2007).
S.J. Jeon, S.M. Hyun, H.J. Lee, J.W. Kim, S.S. Ha, J.W. Yoon, S.B. Jung, and H.J. Lee, Microelectron. Eng. 85, 1967 (2008).
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Ha, SS., Jang, JK., Ha, SO. et al. Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test. J. Electron. Mater. 38, 2489–2495 (2009). https://doi.org/10.1007/s11664-009-0916-y
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DOI: https://doi.org/10.1007/s11664-009-0916-y