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Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 1: Eutectic Lead Solder

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Abstract

This experimental study is devoted to a phenomenological and quantitative investigation of the physics of spreading kinetics of eutectic lead solder systems (Pb-63Sn) over Cu6Sn5/Cu3Sn/Cu (IMC) substrates. The spreading kinetics was studied experimentally by using real-time in situ monitoring of the triple-line movement. Data gathering was facilitated by a hot-stage microscopy system under a controlled atmosphere. Three intermetallic surfaces with different heat treatment conditions were used for this investigation. Dramatically more pronounced spreading of Pb-63Sn on all intermetallic Cu6Sn5/Cu3Sn/Cu substrates compared with Cu substrates was observed, along with a much larger spreading area. Hence the physics/chemistry of spreading over IMCs significantly differs from the spreading of the same system over a virgin Cu substrate. A power-law initial stage of spreading was confirmed, and the corresponding power-law exponents were determined as a function of substrate topography.

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Authors and Affiliations

  1. Center for Manufacturing, University of Kentucky, Lexington, KY, 40506, USA

    H. Zhao & D. P. Sekulic

  2. College of Material Science and Engineering, South China University of Technology, Guangzhou, 510640, PR China

    H. Q. Wang

  3. Department of Mechanical Engineering, College of Engineering, University of Kentucky, Lexington, KY, 40506, USA

    D. P. Sekulic

  4. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin, 150001, PR China

    Y. Y. Qian

Authors
  1. H. Zhao
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  2. H. Q. Wang
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  3. D. P. Sekulic
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  4. Y. Y. Qian
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Correspondence to D. P. Sekulic.

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Zhao, H., Wang, H.Q., Sekulic, D.P. et al. Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 1: Eutectic Lead Solder. J. Electron. Mater. 38, 1838–1845 (2009). https://doi.org/10.1007/s11664-009-0869-1

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  • DOI: https://doi.org/10.1007/s11664-009-0869-1

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