The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO2 ball indenter under ambient conditions. After compression, tin whiskers and small nodules were found adjacent to, and several grains further away from, the indents. The cross-sectional microstructures of the indents and whiskers indicate that the lateral boundaries of the newly created grains caused by recrystallization are the main routes for stress relaxation.
Article PDF
Avoid common mistakes on your manuscript.
References
G.T. Galyon, IEEE T. Electron. Pa. M. 28 (2005) 94
B.-Z. Lee, D.N. Lee, Acta Mater. 46 (1998) 3701
W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, M.E. Williams, G.R. Stafford, Acta Mater. 53 (2005) 5033
W.J. Choi, G. Galyon, K.N. Tu, and T.Y. Lee, Handbook of Lead-free Solder Technology for Microelectronic Assemblies, ed. K.J. Puttlitz and K.A. Stalter (Marcel Dekker Inc., New York, 2004), pp. 851–914
Y. Yorikado, K.-S. Kim, K. Suganuma, M. Tsujimoto, and I. Yanada, in preparation for publication (2007)
S.-K. Lin, J. Jiang, Y. Yorikado, K.-S. Kim, K. Suganuma, S.-W. Chen, M. Tsujimoto, and I. Yanada, J. Mater. Res. 22, 1975 (2007)
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3rd ed., McGraw-Hill, New York, 2000
W.R. Runyan, Silicon Semiconductor Technology, MiGraw-Hill, New York, 1965
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Open Access This is an open access article distributed under the terms of the Creative Commons Attribution Noncommercial License ( https://creativecommons.org/licenses/by-nc/2.0 ), which permits any noncommercial use, distribution, and reproduction in any medium, provided the original author(s) and source are credited.
About this article
Cite this article
Lin, SK., Yorikado, Y., Jiang, J. et al. Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers. J. Electron. Mater. 36, 1732–1734 (2007). https://doi.org/10.1007/s11664-007-0284-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-007-0284-4