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On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys

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Abstract

We report on the nature of the orientation of Ag3Sn and the Ag3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag3Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag3Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag3Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.

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Acknowledgements

The authors gratefully acknowledge financial support for support of this research from the National Science Foundation under Contract #DMR-0092530 (Drs. H. Chopra, S. Ankem, B. MacDonald, and K.L.␣Murty, Program Managers).

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Author notes

  1. Shantanu V. Madge

    Present address: International Advanced Research Centre for Powder Metallurgy and New Materials, Hyderabad, India

  2. Xin Deng

    Present address: Kennametal Inc, Rogers, AK, USA

Authors and Affiliations

  1. School of Materials, Fulton School of Engineering, Arizona State University, Tempe, AZ, 85287-8706, USA

    Rajen S. Sidhu, Shantanu V. Madge, Xin Deng & Nikhilesh Chawla

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  1. Rajen S. Sidhu
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  2. Shantanu V. Madge
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  3. Xin Deng
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  4. Nikhilesh Chawla
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Correspondence to Nikhilesh Chawla.

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Sidhu, R.S., Madge, S.V., Deng, X. et al. On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys. J. Electron. Mater. 36, 1615–1620 (2007). https://doi.org/10.1007/s11664-007-0239-9

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  • DOI: https://doi.org/10.1007/s11664-007-0239-9

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