Abstract
The ball impact test was developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around intermetallics, similar to that from a board-level drop test. We investigated numerically the effects of constitutive relationships of solder alloy on transient structural responses of a single package-level solder joint subjected to ball impact testing. This study focused on the characteristics of the ascending part of the impact force profile. According to the piecewise linear stress-strain curve obtained for the Sn-4Ag-0.5Cu solder alloy, parametric studies were performed by varying either segmental moduli or characteristic stresses of the curve at fixed ratios, with regard to the lack of available rate-dependent material properties of solder alloys.
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Yeh, CL., Lai, YS. Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test. J. Electron. Mater. 35, 1892–1901 (2006). https://doi.org/10.1007/s11664-006-0173-2
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DOI: https://doi.org/10.1007/s11664-006-0173-2