Abstract
A thermodynamic database for the Pb-free soldering alloy systems, which include Sn, Ag, Cu, Bi, and In, has been made using the CALPHAD method. The resulting thermodynamic properties of the Sn-based binary alloy systems were used to determine the surface tensions and viscosities. The surface tensions were calculated using Butler’s monolayer model and the viscosities by Hirai’s and Seetharaman’s models. Butler’s model was also used to determine the surface active element. The results for binary systems were extended to the Sn-based ternary systems (Sn-Ag-Cu, Sn-Ag-Bi). The surface tensions of commercial eutectic Sn-Pb and Sn-Pb-Ag solder alloys were measured by the sessile drop method. The measured values and other researchers’ results were compared with the calculated data.
Similar content being viewed by others
References
S.K. Kang et al., Proc. 49th ECTC 283 (1999).
G. Ghosh, J. Electron. Mater. 29, 1182 (2000).
J.A.V. Butler, Proc. Roy. Soc. A135, 348 (1932).
L. Kaufman and H. Bernstein. computer Calculation of Phase Diagrams (New York: Academic Press, 1970).
F. Bashforth and J.C. Adams, Attempt to Test the Theories of Capillary Action (Cambridge, U.K.: Cambridge University Press, 1883).
E.A. Brandes, Smithells Metals Reference Book, 6th Ed. (London: Butterworths, 1983).
R. Speiser, D.R. Poirier, and K.S. Yeum, Scripta Metall. 21, 687 (1987).
T.P. Hoar and D.A. Melford, Trans. Faraday Soc. 53, 315 (1957).
T. Tanaka, K. Hack, and S. Hara, MRS Bulletin 45 (1999).
O. Redlich and A.T. Kister, Ind. Eng. Chem. 40, 345 (1948).
Y.-M. Muggianu, M. Gambino, and J.-P. Bros, J. Chim. Phys. 72, 83 (1975).
M. Hirai, ISIJ Int. 33, 251 (1993).
S. Seetharaman and Du Sichen, Metall. Mat. Trans. 25B, 589 (1994).
B. Zimmermann (Ph.D. Thesis, Univ. Stuttgart, 1976).
F.H. Hayes, H.L. Lukas, G. Effenberg, and G.Z. Petzow, Z. Metallkd. 77, 749 (1986).
U.R. Kattner and W.J. Boettinger, J. Electron. Mater. 23, 603 (1994).
B.-J. Lee, C.-S. Oh, and J.-H. Shim, J. Electron. Mater. 25, 983 (1996).
J.-H. Shim, C.-S. Oh, and B.-J. Lee, and D.N. Lee, Z. Metallkd. 87, 205 (1996).
I. Karakaya and W.T. Thompson, Bulletin of Alloy Phase Diagrams 9, 144 (1998).
D.W.G. White, Metall. Trans. 2, 3067 (1971).
I. Lauermann, G. Metzger, and F. Sauerwald, Z. Phys. Chem. 216, 42 (1961).
J.W. Tayor, Acta Metall. Mater. 4, 460 (1956).
V.F. Kovalchuk and V.A. Kuznetsov, Z. Fiz. Khim. 42, 1754 (1968).
E. Gebhardt, M. Becher, and E. Tragner, Z. Metallkd. 44, 379 (1953).
N.E. Bodakin, B.A. Baum, and G.V. Tyagunov, Izv. Vyssh. Uchebn. Zaved., Chern. Metall. 7, 9 (1978).
H. Walsdorfer, I. Alpshofen, and B. Predel, Z. Metallkd. 79, 503 (1998).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Lee, J.H., Lee, D.N. Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems. J. Electron. Mater. 30, 1112–1119 (2001). https://doi.org/10.1007/s11664-001-0137-5
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-001-0137-5