Abstract
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.
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Jointly appointed by CAAM at POSTECH
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Lee, JH., Park, D., Moon, JT. et al. Reliability of composite solder bumps produced by an in-situ process. J. Electron. Mater. 29, 1264–1269 (2000). https://doi.org/10.1007/s11664-000-0022-7
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DOI: https://doi.org/10.1007/s11664-000-0022-7