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Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding

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A Correction to this article was published on 18 July 2018

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Abstract

The novel metallurgical joining process for bonding IN718 superalloy was investigated by hot compressive bonding (HCB) process under the deformation temperature range of 1000 °C to 1150 °C and true strains ranging from 0 to 0.5 at a strain rate of 0.001 s−1. The effect of HCB process parameters on the tensile strength was analyzed. Both the as-deformed and the interfacial microstructures were characterized using the optical microscope, electron backscattered diffraction and transmission electron microscope (TEM) analysis. The results of tensile property revealed that the degree of metallurgical bonding is promoted by increasing deformation temperature and strain. The evolution of the interfacial microstructure showed that the migration of interfacial grain boundary (IGB), which is characterized by discontinuous dynamic recrystallization, is the dominant metallurgical bonding mechanism in the early stages of bonding. TEM analysis indicated that the dislocation density is distributed heterogeneously over both sides of IGB, which is the significant reason for the migration of IGB, during the initial stage of HCB process.

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  • 18 July 2018

    First Online: 21 June 2018

    The authors would like to acknowledge the financial support given by the National Key Research and Development Program (Grant Number 2016YFB0300401), National Natural Science Foundation of China (Grant Number U1508215), Key Program of the Chinese Academy of Sciences (Grant Number ZDRW-CN-2017-1), and the National Natural Science Foundation of China (Grant Number 51774265). The authors would also like to thank Bijun Xie and Yifeng Guo for their help in the experimental work.

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Acknowledgments

The authors would like to thank Bijun Xie and Yifeng Guo for their help in the experimental work.

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology of China, Hefei, 230026, P.R. China

    Jian Yang Zhang

  2. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, P.R. China

    Ming Yue Sun, Bin Xu & Dian Zhong Li

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  1. Jian Yang Zhang
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  2. Ming Yue Sun
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  3. Bin Xu
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Correspondence to Ming Yue Sun.

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Manuscript submitted August 31, 2017.

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Zhang, J.Y., Sun, M.Y., Xu, B. et al. Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding. Metall Mater Trans B 49, 2152–2162 (2018). https://doi.org/10.1007/s11663-018-1313-9

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