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Auger electron spectroscopy analysis at the ultrasonically welded interface between alumina and aluminum

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Abstract

In the ultrasonic welding process, it is well known that the bonding between both faying surfaces can be completed by ultrasonically agitating them for a short duration, such as 1 second, at room temperature. In this study, the atomic interaction (chemical bonding) across the interface between aluminum and an alumina ceramic, which was ultrasonically bonded using an ultrasonic pulse that lasted for a short time of 1.5 seconds, was analyzed by means of Auger electron spectroscopy (AES) in order to clarify whether chemical bonding can be achieved across the interface. The Auger spectra analyses results suggest that chemical bonding exists between Al and O across the aluminum/alumina interface bonded ultrasonically for short duration of 1.5 seconds, and that aluminum was chemically bonded to alumina.

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Authors and Affiliations

  1. Faculty of Engineering, Niigata University, Ikarashi, 950-2181, Niigata, Japan

    Takehiko Watanabe (Professor) & Atsushi Yanagisawa (Research Assistant)

  2. Graduate School, Niigata University, Ikarashi, 950-2181, Niigata, Japan

    Shiro Sunaga (Student)

Authors
  1. Takehiko Watanabe
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  2. Atsushi Yanagisawa
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  3. Shiro Sunaga
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Watanabe, T., Yanagisawa, A. & Sunaga, S. Auger electron spectroscopy analysis at the ultrasonically welded interface between alumina and aluminum. Metall Mater Trans A 34, 1107–1111 (2003). https://doi.org/10.1007/s11661-003-0130-0

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  • DOI: https://doi.org/10.1007/s11661-003-0130-0

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