Skip to main content
Log in

Current Trends and Future Directions in MEMS

  • Murray Lecture
  • Published:
Experimental Mechanics Aims and scope Submit manuscript

Abstract

Demands for microelectromechanical systems (MEMS) (also known as microsystems technology, or MST) are continuously growing and it is predicted that they will continue to grow for, at least, a few more decades. For example, MEMS based products produced in 2005 had a value of $8 billion, 40% of which was in sensors. The balance was for products that included micromachined features, such as ink jet print heads, catheters, and RF IC chips with embedded inductors. Growth projections follow a rapidly increasing curve, with the value of products rising to $40 billion in 2015 and $200 billion in 2025! Growth to date has come from a combination of technology displacement, as exemplified by automotive pressure sensors and airbag accelerometers, new products, such as miniaturized guidance systems, and MEMS RF devices. Much of the growth in MEMS business is expected to come from products that are in early stages of development or yet to be invented. Some of these products include disposable chips for performing assays on blood and tissue samples, which are now performed in hospital laboratories, integrated optical switching and processing chips, as well as various RF communication and remote sensing products. In particular, MEMS are found uniquely suitable for detection, analysis, and mitigation of damage as well as for new, very capable, devices that are being developed and will become available in the future. This paper addresses development of representative MEMS of contemporary interest and illustrates their use in applications relating to daily life as well as to some of the most challenging tasks in today’s experimental mechanics.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19
Fig. 20
Fig. 21
Fig. 22

Similar content being viewed by others

References

  1. Pryputniewicz RJ (2000) “Integrated approach to teaching of design, analysis, and characterization in micromechatronics.” Paper No. IMECE2000/DE-13, ASME—Am. Soc. Mech. Eng., New York, NY

  2. Pryputniewicz RJ (2001) “MEMS design education by case studies.” Paper No. IMECE2001/DE-23292, ASME—Am. Soc. Mech. Eng., New York, NY

  3. Pryputniewicz RJ (2007) Progress in MEMS. Strain 43:1–13

    Article  Google Scholar 

  4. Pryputniewicz DR (1997) ACES approach to the development of microcomponents, MS Thesis, Worcester Polytechnic Institute, Worcester, MA

  5. Pryputniewicz RJ (1994) A hybrid approach to deformation analysis. Proc SPIE 2342:282–296

    Article  Google Scholar 

  6. Furlong C, Pryputniewicz RJ (1998) Hybrid computational and experimental approach for the study and optimization of mechanical components. Opt Eng 37:1448–1455

    Article  Google Scholar 

  7. Furlong C (1999) Hybrid, experimental and computational, approach for the efficient study and optimization of mechanical and electro-mechanical components, Ph.D. Dissertation, Worcester Polytechnic Institute, Worcester, MA

  8. Pryputniewicz EJ (2000) ACES approach to the study of electrostatically driven MEMS microengines, MS Thesis, Worcester Polytechnic Institute, Worcester, MA

  9. Pryputniewicz RJ, Galambos P, Brown GC, Furlong C, Pryputniewicz EJ (2001) ACES characterization of surface micromachined microfluidic devices. Int J Micro Electron Pack (IJMEP) 24:30–36

    Google Scholar 

  10. Pryputniewicz DR, Furlong C, Pryputniewicz RJ (2001) “ACES approach to the study of material properties of MEMS.” Proc. Internat. Symp. on MEMS: Mechanics and Measurements, Portland, OR, pp. 80–83

  11. Pryputniewicz RJ, Furlong C (2002) MEMS and nanotechnology. Worcester Polytechnic Institute, Worcester

    Google Scholar 

  12. Pryputniewicz RJ (1993) Engineering experimentation. Worcester Polytechnic Institute, Worcester

    Google Scholar 

  13. Stout P (1999) “CFD-ACE+ a CAD system for simulation and modeling of MEMS.” Proc. SPIE, Paris, France

  14. Wilkerson PW, Kranz M, Przekwas AJ (2001) “Flip-chip hermetic packaging of RF MEMS.” MEMS4Conference, Berkeley, CA, August 24–26

  15. Przekwas AJ, Turowski M, Furmanczyk M, Hieke A, Pryputniewicz RJ (2001) “Multiphysics design and simulation environment for microelectromechanical systems.” Proc. Symp. on MEMS: Mechanics and Measurements, Portland, OR, pp. 84–89

  16. Pryputniewicz RJ, Pryputniewicz DR, Pryputniewicz EJ (2007) “Effect of process parameters on TED-based Q-factor of MEMS.” Paper No. IPACK2007-33094, ASME—Am. Soc. Mech. Eng., New York, NY

  17. CFDRC (2004) CFD-ACE + Multiphysics software, http://www.cfdrc.com

  18. SRAC (1998) COSMOS/M user’s guide. Structural Research and Analysis Corporation, Santa Monica

    Google Scholar 

  19. Pryputniewicz RJ, Wilkerson PW, Przekwas AJ, Furlong C (2002) “RF MEMS: modeling and simulation of switch dynamics.” Proc. 35th Internat. Symp. on Microelectronics, Denver, CO, pp. 267–272

  20. Pryputniewicz RJ, Furlong C (2003) “Novel optoelectronic methodology for testing of MOEMS.” Proc. Internat. Symp. on MOEMS and Miniaturized Systems III, SPIE-4983: 11–25

  21. Brown GC (1999) Laser interferometric methodologies for characterizing static and dynamic behavior of MEMS, Ph.D. Dissertation, Worcester Polytechnic Institute, Worcester, MA

  22. Pryputniewicz RJ (1995) “Quantitative determination of displacements and strains from holograms.” Ch. 3 in Holographic interferometry, vol. 68 of Springer Series in Sciences, Springer-Verlag, Berlin, pp. 33–72

  23. Pryputniewicz RJ (1981) High precision hologrammetry. Internat Arch Photogramm 24:377–386

    Google Scholar 

  24. Pryputniewicz EJ, Miller SL, deBoer MP, Brown GC, Biederman RR, Pryputniewicz RJ (2000) “Experimental and analytical characterization of dynamic effects in electrostatic microengines.” Proc. Internat. Symp. on Microscale Systems, Orlando, FL, pp. 80–83

  25. Pryputniewicz RJ (1995) Hologram interferometry from silver halide to silicon and … beyond. Proc SPIE 2545:405–427

    Google Scholar 

  26. Pryputniewicz RJ, Shepherd E, Allen JJ, Furlong C (2003) “University—National Laboratory alliance for MEMS education.” Proc. 4th Internat. Symp. on MEMS and Nanotechnology (4th-ISMAN), Charlotte, NC, pp. 364–371

  27. Brown GC, Pryputniewicz RJ (1998) Holographic microscope for measuring displacements of vibrating microbeams using time-average electro-optic holography. Opt Eng 37:1398–1405

    Article  Google Scholar 

  28. Klempner AR, Hefti P, Marinis RT, Pryputniewicz RJ (2004) “Development of a high stability optoelectronic laser interferometric microscope for characterization and optimization of MEMS.” Proc. 15th Internat. Invitational UACEM Symp., Springfield, MA, pp. 275–285

  29. Klempner AR (2006) Development of a modular interferometric microscopy system for characterization of MEMS, MS Thesis, Worcester Polytechnic Institute, Worcester, MA

  30. Marinis RT (2009) Development and implementation of automated interferometric microscope system for study of MEMS inertial sensors, Ph.D. Dissertation, Worcester Polytechnic Institute, Worcester, MA

  31. Pryputniewicz RJ (2007) “Thermal management in RF MEMS Ohmic switches.” Paper No. IPACK2007-33502, ASME—Am. Soc. Mech. Eng., New York, NY

  32. Furlong C, Pryputniewicz RJ (2007) “Integrated approach to development of microelectronic contacts.” Paper No. IPACK2007-33345, ASME—Am. Soc. Mech. Eng., New York, NY

  33. Pryputniewicz RJ, Marinis RT, Klempner AR, Hefti P (2006) “Hybrid methodology for development of MEMS.” Proc. IEEE-PLANS2006 San Diego, CA

  34. Kok R, Furlong C, Pryputniewicz RJ (2003) “Experimental modal analysis using MEMS accelerometers.” Proc. 30th Annual Symp. and Exhibition of IMAPS-NE, Boxboro, MA, pp. 116–123

  35. Marinis TF, Soucy JW, Hanson DS, Pryputniewicz RJ, Marinis RT, Klempner AR (2006) “Isolation of MEMS devices from package stresses by use of compliant metal interposers.” Proc. 56th IEEE Electronic Components & Technology Conf. (56th-IEEE-ECTC), paper No. P1S25-MEMS, San Diego, CA

  36. Mihailovich RE, Kim M, Hacker JBH, Sovero A, Studer J, Higgins JA, DeNatale JF (2001) MEM relay for reconfigurable RF circuits. IEEE Microw Wireless Compon Lett 11:53–55

    Article  Google Scholar 

  37. Pryputniewicz RJ, Marinis RT, Klempner AR, Hefti P (2007) “Novel optoelectronic methodology to facilitate development of MEMS.” Proc. 63rd Annual Meeting of the Institute of Navigation (ION), Cambridge, MA, pp. 203–212

  38. Zunino III JL, Skelton DR, Han W, Pryputniewicz RJ (2007) “Hybrid approach to MEMS reliability assessment.” Paper No. SPIE6563-03, Proc. Internat. Symp., on MOEMS-MEMS 2007: Reliability, Packaging, and Characterization of MEMS, San Jose, CA

  39. Tyco (2000) “Relay contact life.” Application Note 13C3236, Tyco Electronics Corporation—P&B, Winston-Salem, NC

  40. Tyco (2000) “Contact arc phenomenon.” Application Note 13C3203, Tyco Electronics Corporation—P&B, Winston-Salem, NC

  41. Kalpakjian S, Schmid SR (2001) Manufacturing engineering and technology. Prentice-Hall, Upper Saddle River

    Google Scholar 

  42. PTC (2003) Pro/ENGINEER user manual. Parametric Technology Corporation, Needham

    Google Scholar 

  43. PTC (2003) Pro/MECHANICA user guide. Parametric Technology Corporation, Needham

    Google Scholar 

  44. Rosato DA (2002) Thermal analysis system: user manual, v. 6.1, Harvard Thermal, Inc., Harvard, MA

  45. Pryputniewicz RJ, Rosato DA, Furlong C (2003) Measurements and simulation of SMT components. Microelectron Int 20:13–16

    Article  Google Scholar 

  46. Pryputniewicz RJ (2006) “Advances in optoelectronic metrology: from milliscale to nanoscale applications.” Proc. 7th Internat. Symp. on MEMS and Nanotechnology (7-IS MAN), St. Louis, MO, pp. 1–17

  47. Skelton DR, Zunino III JL, Han W, Pryputniewicz RJ (2007) “MEMS reliability assessment: preliminary results.” Paper No. 318, in press: Proc. 8th Internat. Symp., on MEMS and Nanotechnology (8-ISMAN), Springfield, MA

  48. Marinis TF (2009) The future of microelectromechanical systems (MEMS). Strain 45:208–220

    Article  Google Scholar 

Download references

Acknowledgments

The author gratefully acknowledges support by all sponsors and thanks them for their permissions to present the results, of their projects, in this paper. This work was also supported by the NEST Program at WPI-ME/CHSLT.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to R. J. Pryputniewicz.

Additional information

SEM William M. Murray Lecture, June 4, 2008, Orlando, FL USA

Rights and permissions

Reprints and permissions

About this article

Cite this article

Pryputniewicz, R.J. Current Trends and Future Directions in MEMS. Exp Mech 52, 289–303 (2012). https://doi.org/10.1007/s11340-011-9520-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11340-011-9520-1

Keywords

Navigation