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Stress analysis of multi-layer electronic and mechanical systems (MEMS) under fatigue and impact loading conditions

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Abstract

Detailed micro electronic and mechanical systems (MEMS) for a mobile microprocessor complex shape were modeled using Finite Element (FE) processing. Fatigue and impact conditions were performed on the Ball Grid Array (BGA) Integrated Circuit (IC) using Abaqus\CAE finite element analysis software. The main objective of this research is to make sure that BGA products can endure the roughness of the daily usage, where a portable electronic product is habitually coupled with potential damage of functional failure when the device falls.

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Authors and Affiliations

  1. Department of Mechanical Design and Production, Faculty of Engineering at Port-Said, Port-Fouad, Port-Said University, Port-Said, Egypt

    Rasha Mohamed Soliman, Medhat Awad El-Hadek & Shaban Ibrahim Abdu

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  1. Rasha Mohamed Soliman
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  2. Medhat Awad El-Hadek
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  3. Shaban Ibrahim Abdu
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Correspondence to Medhat Awad El-Hadek.

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Soliman, R.M., El-Hadek, M.A. & Abdu, S.I. Stress analysis of multi-layer electronic and mechanical systems (MEMS) under fatigue and impact loading conditions. Int J Mech Mater Des 6, 359–365 (2010). https://doi.org/10.1007/s10999-010-9143-1

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  • DOI: https://doi.org/10.1007/s10999-010-9143-1

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