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In search of thermal effusivity reference materials

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Abstract

Quality initiatives such as ISO 9001 require reference values for laboratory measurements. There are no certified reference materials for the secondary material property of thermal effusivity. Reference values are derived from measurements of thermal conductivity, specific heat capacity, and density. A search of the literature is conducted to find materials with the “best’ values for thermal conductivity, specific heat capacity, and density so that a table of reference values for thermal effusivity may be obtained. Tabulated thermal effusivity values range from 0.04 kW s1/2 m−2 K−1 for expanded polystyrene board to 40 kW s1/2 m−2 K−1 for copper metal.

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References

  1. WK43689. Method for thermal effusivity using the modified transient plane source method. Annual Book of ASTM Standards, vol 14.05. West Conshohocken: ASTM International.

  2. Marin E. Teaching thermal physics by touching. Lat Am J Phys Edu. 2008;2(1):15–7.

    Google Scholar 

  3. Wongsriruksa S, Howes P, Conreen M, Miodownik M. The use of physical property data to predict the touch perception of material. Mater Des. 2012;42:238–44.

    Article  Google Scholar 

  4. D7984. Method for measurement of thermal effusivity of fabrics using a guarded modified transient plan source instrument. Annual Book of ASTM Standards, vol 07.01. West Conshohocken.

  5. Schneider AM, Holcombe BV. Properties influencing coolness to the touch of fabrics. Text Res J. 1991;61(8):488–94.

    Article  Google Scholar 

  6. Businer JA, Buettner KJK. Thermal contact coefficient. J Metrol. 1961;18(3):422.

    Article  Google Scholar 

  7. Wu YC. Material properties criteria for thermal safety. J Mater. 1972;7(4):573–9.

    CAS  Google Scholar 

  8. WK50791. Method for thermal effusivity calibration of the modified transient plane source apparatus. Annual Book of ASTM Standards, vol 14.05. West Conshohocken: ASTM International.

  9. Skoog DA, West DM, Holler FJ, Crouch SR. Standard deviation of calculated results. Fundamentals of analytical chemistry. 8th ed. Grove: Thomson Brooks Cole; 2004. p. 127–33.

    Google Scholar 

  10. Tye RP, Salmon DR. Thermal conductivity certified reference materials: Pyrex 7740 and polymethymethacrylate. In: Dinwiddie RB, Mannello R, editors. Thermal conductivity 26—thermal expansion 14. Lancaster: DEStech Publications; 2005. p. 437–51.

    Google Scholar 

  11. Tye RP, Salmon DR. Development of new thermal conductivity reference materials: a summary of recent contributions by National Physical Laboratory. In: Wang H, Porter WD, Worley G, editors. Thermal conductivity 27—thermal expansion 15. Lancaster: DEStech Publication; 2005. p. 372–81.

    Google Scholar 

  12. Salmon D, Roebben G, Lamberty A, Brandt R. Certification of thermal conductivity and thermal diffusivity up to 1025 K of a glass-ceramic reference material BCR-724. In: Centre JR, editor. Brussels: European Commission; 2007.

  13. Salmon DR, Brandt R, Tye RP. Pyroceram 9606, A certified ceramic reference material for high-temperature thermal transport properties: part 2—certification measurements. Int J Thermophys. 2010;31:355–73.

    Article  CAS  Google Scholar 

  14. Clark J, Tye R. Thermophysical properties reference data for some key engineering alloys. High Temp High Press. 2004;35(36):1–14.

    Google Scholar 

  15. Blumm J, Lindemann A, Niedrig B. Measurement of the thermophysical properties of an NPL thermal conductivity standard Inconel 600. High Temp High Press. 2003/2007;35/36:621–6.

  16. E691. Practice for conducting an interlaboratory study to determine the precision of a test method. Annual Book of ASTM Standards, vol 14.05. West Conshohocken: ASTM International (ASTM).

  17. Moore JP, McElroy DL, Graves RS. Thermal conductivity and electrical resistivity of high-purity copper from 78 to 400 K. Can J Phys. 1967;45:3849–65.

    Article  CAS  Google Scholar 

  18. White GK, Collocott SJ. Heat capacity of reference materials: Cu and W. J Phys Chem Ref Data. 1984;14(4):1251–7.

    Article  Google Scholar 

  19. Anonymous. MatWeb. Accessed 8 Sept 2015.

  20. E1225. Method for thermal conductivity of solids using the guarded-comparative-logitudinal heat flow technique. Annual Book of ASTM Standards. West Conshohocken: ASTM International.

  21. E1269. Method for determining specific heat capacity by differential scanning calorimetry. Annual Book of ASTM Standards, vol 14.02. West Conshohocken: ASTM International.

  22. B703. Method for apparent density of metal powders and related compounds using the Arnold meter. Annual Book of ASTM Standards.

  23. Hurst JG, Giarratanno PJ. Certificate standard reference material 730 thermal conductivity—Tungsten. In: Standards NBo, editor. Washington: National Insitute of Standards and Technology; 1976.

  24. Hurst JG, Lankford AB. Report of investigation research materials 8420 and 8421 Electrolytic iron thermal conductivity and electrical resistivity as a function of temperature from 2 to 1000 K In: Standards NBo, editor. Gaithersburg: National Insitute of Standards and Technology; 1984.

  25. Desai RD. Thermodynamic properties of iron and silicon. J Phys Chem Ref Data. 1986;15(3):967–83.

    Article  CAS  Google Scholar 

  26. Hulstrom LC, Tye RP, Smith SE. Round-robin testing of thermal conductivity reference materials. In: Yarbrough DW, editor. Thermal conductivity 19. New York: Plenum Press; 1986.

    Google Scholar 

  27. Salmon DR, Tye RP. Pyroceram 9606: a certified ceramic reference material for high-temperature thermal transport properties: part 1—material selection and characterization. Int J Thermophys. 2010;31:338–54. https://doi.org/10.1007/s10765-010-0709-9.

    Article  CAS  Google Scholar 

  28. Jacobs-Fedore RA, Stroe DE. Thermophysical properties of Vespel(tm) SP1. In: Wang H, Porter WD, Worley G, editors. Thermal conductivity 27/thermal expansion 15. Lancaster: DEStech Publications; 2005. p. 231–2238.

    Google Scholar 

  29. Gaur U, Wunderlich B. Heat capacity and other thermodynamic properties of linear macromolecules. J Phys Chem Ref Data. 1982;11(2):313–25.

    Article  CAS  Google Scholar 

  30. Zarr RR, Pinter AL. SRM 1453, expanded polystyrene board, for thermal conductivity form 281 K to 313 K. In: Technology NIoSa, editor. Gaithersburg: National Insitute of Standards and Technology; 2012.

  31. Bateman R, editor. Criterion and need for a standard for thermal effusivity measurements. In: 43rd Conference of the North American Thermal Analysis Society, Montreal; 2015.

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  1. RBE Enterprises, Corvallis, OR, USA

    Roger L. Blaine

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  1. Roger L. Blaine
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Correspondence to Roger L. Blaine.

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Blaine, R.L. In search of thermal effusivity reference materials. J Therm Anal Calorim 132, 1419–1422 (2018). https://doi.org/10.1007/s10973-018-7020-6

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  • DOI: https://doi.org/10.1007/s10973-018-7020-6

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