Curing of urea-formaldehyde resins on awood substrate

Abstract

TG-DTA analysis method was used to study the curing behaviour of urea-formaldehyde (UF) adhesive resins in the presence of a wood substrate. The cure process was followed using a Setaram labsys^TM instrument in flowing nitrogen atmosphere by varying the ratio of resin and wood. Resin cure was catalysed with 2% of NH₄Cl. Curing tests were performed in the open standard platinum crucibles and in the sealed glass capsules. To characterise the reactivity of curing system, the peak temperatures in DTA curve and the mass loss values in TG curve were taken as the apparent indices. The main attention was paid to phenomena which actually take place in curing of UF resins during manufacturing of particleboards. Reactivity of the curing system depends mostly on methylol content of resin and can be adequetly evaluated by the maximum temperature of exothermic peak. The wood substrate has a substantial influence on the resin and water diffusion in system causing the changes in water/resin separation and water evaporation conditions. The water movement in curing adhesive joint was a confusing parameter in determining the peak positions. The rate of mass loss on a wood substrate is higher as compared to curing UF resin alone.