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Silicone/polypropylene oxide-polyethylene oxide copolymer/clay composites (i) - curing behavior, intermolecular interaction and thermomechanical properties

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Abstract

This research explores the dispersion pattern, curing behavior and intermolecular interaction of liquid silicone, polypropylene oxide-polyethylene oxide copolymer and clay composites. It analyzes the curing behavior of each component composite by means of the rigid-body pendulum rheometer, and then it is followed by the exploration of the intermolecular interaction with the dynamic mechanical analysis. Results show that the polymer chains of polypropylene oxide-polyethylene oxide copolymer expand clay gallery distance from 1.21 nm to 1.84 nm. Clay, after it has been organically modified (Oc), is added to silicone/polypropylene oxide-polyethylene oxide copolymer (SP) blends and its gallery spacing shortens from 2 nm to 1.7 nm. In the curing behavior of SP/clay composites, ammonium salt ions affect the cross-linking reaction of SP blends. Also, the curing time of Oc is shorter and the reacting rate is increased. Furthermore, clay, Oc and the SP have intermolecular interaction with each other. In addition, the unmodified clay in SP blend enhanced their mechanical and thermal properties.

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Authors and Affiliations

  1. Graduate School of Polymer, National Taiwan University of Science and Technology, Taiwan

    Hsien-Tang Chiu & Jyh-Horng Wu

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  1. Hsien-Tang Chiu
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  2. Jyh-Horng Wu
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Correspondence to Hsien-Tang Chiu.

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Chiu, HT., Wu, JH. Silicone/polypropylene oxide-polyethylene oxide copolymer/clay composites (i) - curing behavior, intermolecular interaction and thermomechanical properties. J Polym Res 11, 247–255 (2005). https://doi.org/10.1007/s10965-005-1878-2

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  • DOI: https://doi.org/10.1007/s10965-005-1878-2

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