Skip to main content

Advertisement

SpringerLink
Log in

Thermal fatigue life of Sn–3.0Ag–0.5Cu solder joint under temperature cycling coupled with electric current

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In this paper, the physical and mechanical properties of Sn–3.0Ag–0.5Cu (SAC305) solder and the thermal fatigue properties of solder joints under different electric current densities and heat sink temperatures are investigated. The thermal and electrical conductivities of the SAC305 specimens are measured for the electric current density between 6.37 × 102 A/cm2 and 2.55 × 103 A/cm2. Through comparisons against the experimental results, it is found that the prediction results of finite element simulations can reasonably characterize the mechanical properties of SAC305 solder materials. In order to evaluate the effect on mechanical behaviour of solder alloys, a typical solder joint of mechanical properties for the upper and lower bounds under thermo-electric coupling conditions are analyzed by finite element simulations. The original Coffin–Manson model is improved to predict the fatigue life of SAC305 solder joints under temperature cycling coupled with electric current. Comparisons show that the different mechanical behaviour of SAC305 solder materials results in different performances at varying electric current densities and heat sink temperatures. For low current densities and heat sink temperatures, the solder material with lower yielding and ultimate strengths has a higher fatigue life. On the contrary, at high current densities and heat sink temperatures, the solder material with higher yielding and ultimate strengths will exhibit advantages in terms of fatigue life. From the numerical simulation point of view, this study reveals the performance advantages of lead-free solders with higher yielding and ultimate strengths in terms of thermal fatigue and current density for high temperature and power applications.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16

Similar content being viewed by others

References

  1. A. Michaelowa, F. Jotzo, Energy Policy 33, 511–523 (2005)

    Article  Google Scholar 

  2. IPC-SM-785, Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments (IPC, Northbrook, 1992)

    Google Scholar 

  3. T. Takemoto, in 6th International Conference on Electronics Packaging Technology (ICEPT), August 30-September 2, Shenzhen, China (2005)

  4. EEC, D., in Directive of the European parliament and of the council on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) (recast)

  5. G. Lee, P. Liang, J. Lin, in International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2008

  6. Norway POHS, in Prohibition on Certain Hazardous Substances in Consumer Products, 2007

  7. J. Nouri, S. Toutounchian, Int. J. Environ. Sci. Technol. 1, 109–117 (2004)

    Article  Google Scholar 

  8. D.S. Steinberg, Preventing Thermal Cycling and Vibration Failures in Electronic Equipment (Wiley, Hoboken, 2001)

    Google Scholar 

  9. W. Yurkowsky, R.E. Schafter, J.M. Finkelstein, Accelerated Testing Technology, Technical Report No. RADC-TR-67-420 (Rome Air Development Center, 1967)

  10. S. Özsoy, M. Çelik, F.S. Kadıoğlu, Eng. Fail. Anal. 15, 946–957 (2008)

    Article  Google Scholar 

  11. H. Hirose, IEEE Trans. Reliab. 42, 650–657 (1993)

    Article  Google Scholar 

  12. A.J. Watkins, IEEE Trans. Reliab. 43, 361–365 (1996)

    Article  Google Scholar 

  13. J.A. Nachlas, Qual. Reliab. Eng. Int. 2, 3–6 (2010)

    Article  Google Scholar 

  14. H. Cui, in Proceedings of 2005 International Conference on Reliability and Maintainability Symposium. (2005)

  15. I. Shohji, H. Mori, Y. Orii, Microelectron. Reliab. 44, 269–274 (2004)

    Article  Google Scholar 

  16. C.L. Liang, K.L. Lin, Mater. Charact. 145, 545–555 (2018)

    Article  Google Scholar 

  17. Z. Zhang, X. Hu, X. Jiang, Y. Li, Metall. Mat. Trans. A. 50, 1–13 (2019)

    Google Scholar 

  18. Dassault Systemes Simulia Corp., ABAQUS User’s Manual 2017 (Hibbitt, Karlsson & Sorensen, Rhode Island, 2017)

    Google Scholar 

  19. Y. Yao, J. Fry, M.E. Fine, L.M. Keer, Acta Mater. 61, 1525–1536 (2013)

    Article  Google Scholar 

  20. L. Qi, J. Zhao, X.M. Wang, L. Wang, in Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability, 2004

  21. X. Long, Y. Liu, Y. Yao, F. Jia, C. Zhou, Y. Fu, Y. Wu, AIP Adv. 8, 085001 (2018)

    Article  Google Scholar 

  22. X. Long, W. Tang, S. Wang, X. He, Y. Yao, J. Mater. Sci. Mater. Electron. 29, 7177–7187 (2018)

    Article  Google Scholar 

  23. T.J. Kilinski, J.R. Lesniak, B.I. Sandor, Solder Joint Reliability: Theory and Applications (1991), pp. 384–405

  24. J. Schijve, Mater. Sci. 25, 679–702 (2003)

    Google Scholar 

  25. R.P. Skelton, Metal Sci. J. 7, 427–440 (2013)

    Google Scholar 

  26. N. Bai, X. Chen, H. Gao, Mater. Des. 30, 122–128 (2009)

    Article  Google Scholar 

  27. N. Bai, X. Chen, Int. J. Plast. 25, 2181–2203 (2009)

    Article  Google Scholar 

  28. W. Engelmaier, IEEE Trans. Compon. Packag. Manuf. 6, 232–237 (2003)

    Google Scholar 

  29. W. Engelmaier, A.I. Attarwala, IEEE Trans. Compon. Packag. Manuf. 12, 284–296 (1989)

    Google Scholar 

  30. Z. Wen, H. Pei, H. Yang, Y. Wu, Z. Yue, Int. J. Fatigue 111, 243–255 (2018)

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Nos. 51508464 and U1537104), the Natural Science Foundation of Shaanxi Province (No. 2017JM1013), the Astronautics Supporting Technology Foundation of China (No. 2019-HT-XG), and the Fundamental Research Funds for the Central Universities (No. 3102018ZY015).

Author information

Authors and Affiliations

  1. School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, 710072, China

    Xu Long

  2. College of Mining Engineering, Liaoning Shihua University, Fushun, 113001, China

    Yongchao Liu

  3. College of Petroleum Engineering, Liaoning Shihua University, Fushun, 113001, China

    Fengrui Jia

  4. Space Research Institute of Electronics and Information Technology, Aerospace Science and Technology Corporation, Xi’an, 710100, China

    Yanpei Wu, Yonghui Fu & Cheng Zhou

Authors
  1. Xu Long
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yongchao Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Fengrui Jia
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yanpei Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Yonghui Fu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Cheng Zhou
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Xu Long.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Long, X., Liu, Y., Jia, F. et al. Thermal fatigue life of Sn–3.0Ag–0.5Cu solder joint under temperature cycling coupled with electric current. J Mater Sci: Mater Electron 30, 7654–7664 (2019). https://doi.org/10.1007/s10854-019-01081-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-019-01081-x

Search

Navigation