Abstract
In the present study, an attempt has been done to prepare an electrically conductive epoxy adhesive filled with the high content of reduced graphene oxide (rGO) (i.e. 10–50 wt%). The lap shear test was performed to study the adhesive strength of epoxy-based adhesive systems. The test results revealed that adhesive with 40 wt% rGO possessed highest shear strength which is 72.8% higher over unmodified epoxy. While the tensile test results showed a decrement of 33% in tensile strength even with the introduction of 10 wt% rGO. The unnotched and notched impact strength of epoxy resin found to be increasing up to 51% and 100% respectively, when 30 wt% rGO was incorporated within the matrix. The fractography analysis of notched impact samples was examined by scanning electron microscopy and unveils that crack pinning is the toughening mechanism for E–rGO adhesive systems. The dispersion assessment of rGO within the epoxy matrix was visualized by transmission electron microscopy technique, revealing the effective distribution of rGO in epoxy matrix. The volume and surface conductivity was increased up to 3.44 × 10−08 S/m and 8.54 × 10−06 S with 50 wt% rGO addition, which are five and five-fold higher in comparison to the epoxy resin. At 35 °C, the thermal conductivity was enhanced by ~ 408% as compared to pristine epoxy, when 50 wt% rGO was included. Fourier transform infra‑red spectroscopy spectra was used to study the nature of interaction between rGO and epoxy matrix. The adhesive systems showed higher thermo-stability with the introduction of rGO as detected by thermo-gravimetric analysis technique.
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T.K.B. Sharmila, A.B. Nair, B.T. Abraham, P.M.S. Beegum, E. Thomas, Polymer (Guildf) 55, 3614 (2014)
H. Feng, X. Wang, D. Wu, Ind. Eng. Chem. Res. 52, 10160 (2014)
X. Zhang, O. Alloul, Q. He, J. Zhu, M. Joseph, Y. Li, S. Wei, Z. Guo, Polymer (Guildf) 54, 3594 (2013)
Z.A. Ghaleb, M. Mariatti, Z.M. Ariff, Composites A 58, 77 (2014)
P. Pokharel, Q. Truong, D.S. Lee, Composites B 64, 187 (2014)
G. Tang, Z. Jiang, X. Li, H. Zhang, S. Hong, Z. Yu, Composites B 67, 564 (2014)
Graphenea, Reduced Graphene Oxide: Properties, Applications and Production Methods. (2015). https://www.azonano.com/article.aspx?ArticleID=4041. Accessed 10 May 2018
M. Lundie, Z. Sljivancanin, S. Tomic, J. Mater. Chem. C 3, 7632 (2015)
J.M. Vazquez-moreno, V. Yuste-sanchez, R. Sanchez-hidalgo, R. Verdejo, Eur. Polym. J. 93, 1 (2017)
H. Fan, M.M. Yuen, Nanopackaging (Springer, Cham, 2008), pp. 39–59
G.Y. Li, C.P. Wong, Micro-and Opto-Electronic Materials and Structures, vol 2, (Springer, New York, 2007), pp. B611–B627
S. Takeda, T. Masuko, N. Takano, T. Inada, Materials for Advanced Packaging, (Springer, Cham, 2017), pp. 469–510
B.S. Yim, B.H. Lee, J. Kim, J.M. Kim, J. Mater. Sci.: Mater. Electron. 25, 5208 (2014)
B.S. Yim, J.M. Kim, J. Mater. Sci.: Mater. Electron. 26, 1678 (2015)
M. Li, C. Tang, L. Zhang, B. Shang, S. Zheng, J. Mater. Sci.: Mater. Electron. 28, 15694 (2017)
J. Kim, B. Yim, J. Kim, J. Kim, Microelectron. Reliab. 52, 595 (2012)
E. Sancaktar, L. Bai, Polymer (Basel) 3, 427 (2011)
A.K. Singh, B.P. Panda, S. Mohanty, S.K. Nayak, M.K. Gupta, Polym. Adv. Technol. 28, 1851 (2017)
R. Aradhana, S. Mohanty, S.K. Nayak, Polymer (Guildf) 141, 109 (2018)
N. Yousefi, X. Lin, Q. Zheng, X. Shen, J.R. Pothnis, J. Jia, E. Zussman, J. Kim, Carbon 59, 406 (2013)
T.K.B. Sharmila, J.V. Antony, M.P. Jayakrishnan, P.M.S. Beegum, E. Thomas, Mater. Des. 90, 66 (2016)
Y.T. Lin, T.M. Don, C.J. Wong, F.C. Meng, Y.J. Lin, S.Y. Lee, C.F. Lee, W.Y. Chiu, Surf. Coat. Technol. (2018). https://doi.org/10.1016/j.surfcoat.2018.01.050
Y. Che, Z. Sun, R. Zhan, S. Wang, S. Zhou, J. Huang, Ceram. Int. 44, 18067 (2018)
A.K. Singh, A. Parhi, B.P. Panda, S. Mohanty, S.K. Nayak, M.K. Gupta, J. Mater. Sci.: Mater. Electron. 28, 17655 (2017)
A.K. Singh, B.P. Panda, S. Mohanty, S.K. Nayak, M.K. Gupta, J. Mater. Sci.: Mater. Electron. 28, 8908 (2017)
S.M. Suresh Kumar, K. Subramanian, Adv. Polym. Technol. 37, 612 (2016)
N. Norhakim, S. Ahmad, C. Chia, N. Huang, Sains Malaysiana 43, 603 (2014)
N. Adak, S. Chhetri, N. Murmu, P. Samanta, T. Kuila, Crystals 8, 111 (2018)
L.R. Galicia, L.N. Mendez, A.L.M. Hernadez, A.E. Gonzalez, I.R.G. Esquivel, R.F. Ramirez, C.V. Santos, Int. J. Polym. Sci. (2013). https://doi.org/10.1155/2013/493147
S. Chhetri, N.C. Adak, P. Samanta, N.C. Murmu, T. Kuila, Polym. Test. 63, 1 (2017)
H.J. Salavagione, G. Martínez, G. Ellis, Physics and Applications of Graphene Experiments (Intech, London, 2013), pp. 169–192
W. Li, H. Li, X. Yang, W. Feng, H. Huang, J. Compos. Mater. 51, 1197 (2017)
J. Tang, H. Zhou, Y. Liang, X. Shi, X. Yang, J. Zhang, J. Nanomater. (2014).https://doi.org/10.1155/2014/696859
S.-Y. Lee, M.-H. Chong, M. Park, H.-Y. Kim, S.-J. Park, Carbon Lett. 15, 67 (2014)
R. Aradhana, S. Mohanty, S.K. Nayak, Int. J. Adhes. 84, 238 (2018)
Q. Liu, X. Yao, Z. Liu, Adv. Mater. Res. 391, 175 (2012)
Y. Sun, L. Chen, J. Lin, P. Cui, M. Li, X. Du, J. Compos. Mater. 51, 1743 (2017)
N. Yousefi, X. Lin, X. Shen, J. Jia, J. Kim, ECCM 2014. 1 (2014)
N. Yousefi, X.Y. Lin, X. Shen, J.J. Jia, O.J. Dada, J.K. Kim, ICCM-19, 1 (2013)
S. Chhetri, P. Samanta, N. Chandra Murmu, S. Kumar, Srivastava, T. Kuila, AIMS Mater. Sci. 4, 61 (2016)
A. Ravindran, C. Feng, S. Huang, Y. Wang, Z. Zhao, J. Yang, Polymer (Basel)10, 477 (2018)
Y.X. Fu, Z.X. He, D.C. Mo, S.S. Lu, Int. J. Therm. Sci. 86, 276 (2014)
G.B. Olowojoba, S. Kopsidas, S. Eslava, E.S. Gutierrez, A.J. Kinloch, C. Mattevi, V.G. Rocha, A.C. Taylor, J. Mater. Sci. 52, 7323 (2017)
B. Tang, G. Hu, H. Gao, L. Hai, Int. J. Heat Mass Transf. 85, 420 (2015)
D. Konios, M.M. Stylianakis, E. Stratakis, E. Kymakis, J. Colloid Interface Sci. 430, 108 (2014)
R. Aradhana, S. Mohanty, S. Kumar, Compos. Sci. Technol. 169, 86 (2019)
C. Bora, P. Gogoi, S. Baglari, S.K. Dolui, J. Appl. Polym. Sci. 129, 3432 (2013)
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Aradhana, R., Mohanty, S. & Nayak, S.K. High performance electrically conductive epoxy/reduced graphene oxide adhesives for electronics packaging applications. J Mater Sci: Mater Electron 30, 4296–4309 (2019). https://doi.org/10.1007/s10854-019-00722-5
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DOI: https://doi.org/10.1007/s10854-019-00722-5