Abstract
In the present work, we have demonstrated the micro-supercapacitor behavior of titanium vanadium nitride thin films fabricated on stainless steel substrates by a pulsed DC magnetron sputtering technique. The microstructural characterization from X-ray diffraction (XRD) reveals the FCC structure of TiVN thin films with a preferred (200) orientation. A faceted morphology with square-edge shaped dense grains of the thin films is observed from field emission scanning electron microscopy (FESEM) and transmission electron microscopy (TEM) images. Ion scattering spectroscopy (ISS) and X-ray photoelectron spectroscopy (XPS) was used to determine the surface compositions and confirmed the absence of impurities. The specific capacitance (Csp) of the electrode material was evaluated by cyclic voltammetry (CV). Galvanostatic charge–discharge (CD) test and the electrochemical impedance spectroscopy (EIS) measurements were also performed. The electrochemical result of fabricated TiVN displays a supercapacitive behavior. A maximum Csp of 69 F/g (volumetric capacitance of 155.94 F/cm3) is obtained from both CV and CD studies. The experimental results reveal that the sputtered TiVN thin films area promising electrode material for electrochemical micro-supercapacitors.
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig1_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig2_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig3_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig4_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig5_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig6_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs10854-018-9364-x/MediaObjects/10854_2018_9364_Fig7_HTML.gif)
Similar content being viewed by others
References
P. Yang, D. Chao, C. Zhu, X. Xia, Y. Zhang, X. Wang, P. Sun, B.K. Tay, Z.X. Shen, W. Mai, H.J. Fan, Adv. Sci. 3, 1500299 (2016)
A. Achour, R. Lucio-Porto, M. Chaker, A. Arman, A. Ahmadpourian, M.A. Soussou, M. Boujtita, L. Le Brizoual, M.A. Djouadi, T. Brousse. Electrochem. Commun. 77, 40 (2017)
A. Achour, R.L. Porto, M.A. Soussou, M. Islam, M. Boujtita, K.A. Aissa, L. Le Brizoual, A. Djouadi, T. Brousse, J. Power Sources 300, 525 (2015)
Y. Xie, X. Fang, Electrochim. Acta 120, 273 (2014)
M.S. Balogun et al., J. Mater. Chem. A 3(4), 1364 (2015)
P. Simon, Y. Gogotsi, Nat. Mater. 7(11), 845 (2008)
S. T. Oyama (ed.), The Chemistry of Transition Metal Carbides and Nitrides (Blackie Academic, 1996). ISBN 0-7514-0365-2
Y.J.B. Ting, K. Lian, N. Kherani, ECS Trans. 35(32), 133 (2011)
M.S. Balogun, W. Qiu, W. Wang, P. Fang, X. Lu, Y. Tong, J. Mater. Chem. A 3, 1364 (2015)
D. Choi, G.E. Blomgren, P.N. Kumta, Adv. Mater. 18, 1178 (2006)
S. Dong, X. Chen, L. Gu, X. Zhou, H. Xu, H. Wang, Z. Liu, P. Han, J. Yao, L. Wang, G. Cui, L. Chen, ACS Appl. Mater. Interfaces 3(1), 93–98 (2011)
D. Rosestolato, G. Battaglin, S. Ferro, Batteries 1, 11 (2015)
D. Shu, C. Lv, F. Cheng, C. He, K. Yang, J. Nan, L. Long, Int. J. Electrochem. Sci. 8, 1209 (2013)
E. Eustache, R. Frappier, R.L. Porto, S. Bouhtiyya, J.F. Pierson, T. Brousse, Electrochem. Commun. 28, 104 (2013)
X. Lu, M. Yu, T. Zhai, G. Wang, S. Xie, T. Liu, C. Liang, Y. Tong, Y. Li, Nano Lett. 13, 2628 (2013)
J.C. Caicedoa, G. Zambranoa, W. Aperadorb, L. Escobar-Alarconc, E. Camps, Appl. Surf. Sci. 258, 312 (2011)
X. Zhou, C. Shang, L. Gu, S. Dong, X. Chen, P. Han, L. Li, J. Yao, Z. Liu, H. Xu, Y. Zhu, G. Cui, ACS Appl. Mater. Interfaces 3, FF58 (2011)
S. Bouhtiyya, R.L. Porto, B. Laïk, P. Boulet, F. Capon, J.P. Pereira-Ramos, T. Brousse, J.F. Pierson, Scr. Mater. 68, 659 (2013)
Y. Qiu, L. Gao., J. Phys. Chem. B 109, 19732 (2005)
D.W. Choi, P.N. Kumta, Electrochem. Solid State Lett. 8(8), A418 (2005)
A.M. Glushenkov, D. Hulicova-Jurcakova, D. Llewellyn, G.Q. Lu, Y. Chen, Chem. Mater. 22(3), 914 (2010)
L. Zhang, C.M.B. Holt, E.J. Luber, B.C. Olsen, H.T. Wang, M. Danaie, X.W. Cui, X.H. Tan, V.W. Lui, W.P. Kalisvaart, D. Mitlin, J. Phys. Chem. C 115(49), 24381 (2011)
G. Wang, X. Lu, Y. Ling, T. Zhai, H. Wang, Y. Tong, Y. Li, ACS Nano 6(11), 10296 (2012)
C. Zhu et al., Adv. Mater. 27(31), 4566 (2015)
E. Enriquez, Y. Zhang, A. Chen, Z. Bi, Y. Wang, E. Fu, Z. Harrell, X. Lu, P. Dowden, H. Wang, C. Chen, Q. Ji, Appl. Phys. Lett. 109(1–6), 081907 (2016)
S. Dong, X. Chen, L. Gu, X. Zhou, H. Wang, Z. Liu, P. Han, J. Yao, L. Wang, G. Cui, L. Chen, Mater. Res. Bull. 46, 835 (2011)
J. Chmiola, C. Largeot, P.-L. Taberna, P. Simon, Y. Gogotsi, Science 328, 480 (2010)
P.J. Hanumantha, M.K. Datta, K.S. Kadakia, D.H. Hong, S.J. Chung, M.C. Tam, J.A. Poston, A. Manivannan, P.N. Kumta, J. Electrochem. Soc. 160(11), A2195 (2013)
B. Avasarala, P. Haldar, Electrochim. Acta 55(28/1), 9024 (2010)
A. Achour, J.B. Ducros, R.L. Porto, M. Boujtita, E. Gautron, L. Le Brizoual, M.A. Djouadi, T. Brousse, Nano Energy 7, 104 (2014)
T. Deeleard, S. Chaiyakun, A. Pokaipisit, P. Limsuwan, Mater. Sci. Appl. 4, 556 (2013)
O. Knotek, A. Barimani, B. Bosserhoff, F. Loffler, Thin Solid Films 193–194, 557 (1990)
H. Guo, B. Li, J. Wang, W. Chen, W. Wang, Z. Zhang, J. Jia, RSC Adv. (2016). https://doi.org/10.1039/C6RA02403C
S.R. Ede, A. Ramadoss, S. Anantharaj, U. Nithiyanantham, S. Kundu, Phys. Chem. Chem. Phys. 16, 21846 (2014)
A. Morel, Y. Borjon-Piron, R.L. Porto, T. Brousse, D. Bélanger, J. Electrochem. Soc. 163(6), A1077 (2016)
A. Achour, M. Chaker, H. Achour, A. Arman, M. Islam, M. Mardani, M. Boujtita, L. Le Brizoual, M.A. Djouadi, T. Brousse, J. Power Sources 359, 349 (2017)
U. Nithiyanantham, A. Ramadoss, S. Kundu, Dalton Trans. 45, 3506 (2016)
U. Nithiyanantham, S.R. Ede, T. Kesavan, P. Ragupathy, M.D. Mukadam, S.M. Yusuf, S. Kundu, RSC Adv. 4, 38169 (2014)
K.H. Thulasi Raman, T.R. Penki, N. Munichandraiah, G.M. Rao, Electrochim. Acta 125, 282 (2014)
W. Avansi Jr., R. Arenal, V.R. de Mendonça, C. Ribeiro, E. Longo, CrystEngComm 16, 5021 (2014)
Acknowledgements
Authors thank the Board of Research in Nuclear Sciences (BRNS), Department of Atomic Energy (DAE), Mumbai, for the research Grant No. 2012/37P/38/BRNS to perform this work. Authors appreciate the help from Mr A. Rathish Kumar (TEM in-charge, Central Instrumentation Facility, CECRI).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Anusha Thampi, V.V., Nithiyanantham, U., Nanda Kumar, A.K. et al. Fabrication of sputtered titanium vanadium nitride (TiVN) thin films for micro-supercapacitors. J Mater Sci: Mater Electron 29, 12457–12465 (2018). https://doi.org/10.1007/s10854-018-9364-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-018-9364-x