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Low-temperature sintering of metallacyclic stabilized copper nanoparticles and adhesion enhancement of conductive copper film to a polyimide substrate

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Abstract

We report that both low electric resistivity and strong adhesion to polyimide film were attained for a conductive Cu film prepared by low-temperature sintering of 2-amino-1-butanol-protected Cu nanoparticles (AB-Cu NPs) with an average size of 4.4 nm. The sintering temperature of 60 °C for the AB-Cu NPs is the lowest ever reported for Cu NPs. A nanoink comprising these AB-Cu NPs (~35 wt% Cu) produced a conductive Cu film with resistivity of 52 μΩ cm after heating at 150 °C under a nitrogen flow. The adhesion to a polyimide film was compared for films prepared from nanoinks consisting of three different types of alkanol-amine-based Cu NPs: AB-Cu NPs, 1-amino-2-propanol-Cu NPs, and 3-amino-1-propanol-Cu NPs. Only the Cu film prepared from the AB-Cu nanoink established strong adhesion to the substrate without decreasing the electrical conductivity. The adhesiveness is attributed to residual oxidation products after thermal sintering of the Cu nanoinks.

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Acknowledgments

We thank Mr. Daisuke Murahashi and Ms. Kazuko Yamashita at Kansai University for the GC–MS measurements. This work was supported by JSPS KAKENHI (Grant Nos. 15H03520, 15H03526, 26505011 and 26107719) and Hitachi Metals Materials Science Foundation.

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Authors and Affiliations

  1. Faculty of Chemistry, Materials and Bioengineering, Kansai University, 3-3-35 Yamate-cho, Suita, 564-8680, Japan

    Tomonori Sugiyama, Mai Kanzaki, Ryuichi Arakawa & Hideya Kawasaki

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  1. Tomonori Sugiyama
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  2. Mai Kanzaki
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  3. Ryuichi Arakawa
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  4. Hideya Kawasaki
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Correspondence to Hideya Kawasaki.

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Sugiyama, T., Kanzaki, M., Arakawa, R. et al. Low-temperature sintering of metallacyclic stabilized copper nanoparticles and adhesion enhancement of conductive copper film to a polyimide substrate. J Mater Sci: Mater Electron 27, 7540–7547 (2016). https://doi.org/10.1007/s10854-016-4734-8

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  • DOI: https://doi.org/10.1007/s10854-016-4734-8

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