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Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

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Abstract

Electromigration (EM) phenomenon has become more troublesome in the Sn–Bi solder joints as the increase of current density. Doping method is reported as one of the solution to improve solder joints. However, the doped particles are easily aggregated and formed large sized intermetallic compounds (IMCs) in the solder matrix during reflow soldering. In this research, EM phenomenon was studied in the Sn57.6Bi0.4Ag, Sn58Bi with 0.4 wt% Ag doping (Sn58Bi + 0.4Ag) and Sn58Bi solder joints to fully understand the influence of the aggregated Ag3Sn IMCs. The grain refinement effect of the Ag element was found to be the main reason of the improvement of EM phenomenon. Also, it was proved that Sn57.6Bi0.4Ag solder joints with uniformly distributed Ag3Sn IMCs performed well in preventing the segregation of Bi phase. However, Sn58Bi + 0.4Ag solder joints with the aggregated Ag3Sn IMCs did not perform well, forming thicker Bi rich layer at the anode. On the other hand, the addition of Ag element had minimal effect on the formation and consumption of Cu–Sn IMCs in the Sn–Bi solder joints. The thickness of Cu–Sn IMCs layer at the cathode in the Sn57.6Bi0.4Ag and Sn58Bi solder joints were found to be similar. However, the aggregated Ag3Sn IMCs in the Sn58Bi + 0.4Ag solder joints could promote the migration of Cu–Sn IMCs to the cathode.

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Acknowledgments

The authors would like to acknowledge the financial support provided by the National Natural Science Foundation of China/Research Grants Council of Hong Kong (NSFC/RGC), Ref. No. 9054008/N_CityU101/12.

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Authors and Affiliations

  1. Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong

    Huayu Sun & Y. C. Chan

  2. Department of Material Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, China

    Fengshun Wu

Authors
  1. Huayu Sun
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  2. Y. C. Chan
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  3. Fengshun Wu
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Correspondence to Huayu Sun.

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Sun, H., Chan, Y.C. & Wu, F. Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints. J Mater Sci: Mater Electron 26, 5129–5134 (2015). https://doi.org/10.1007/s10854-015-3040-1

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  • DOI: https://doi.org/10.1007/s10854-015-3040-1

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