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Physical and electrical properties of polyimide/ceramic hybrid films prepared via non-hydrolytic sol–gel process

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Abstract

In this study, TiO2 and SiO2 were chosen as ceramic fillers in the 3,3′,4,4′-benzophenone tetracarboxylic dianhydride–4,4′-oxydianiline (BTDA–ODA) polyimide matrix. Physical properties of hybrids with up to 30 wt% SiO2 and 7 wt% TiO2 were evaluated and discussed. Nano-size ceramic particles were prepared by non-hydrolytic sol–gel (NHSG) process. SEM micrographs show that both films have nano-sized ceramic particles with a narrow size distribution. Thermal conductivities of the hybrids increase from 0.12 to 0.21 W/m-K, as the SiO2 and TiO2 in the hybrid increases from 0 to 30 and 7 wt%, respectively. Electrical surface resistivity slightly decreases with increasing ceramic filler content. Dielectric constant of the hybrid increases from 2.45 to 2.72 with the incorporation of the 7 wt% (5.4 vol%) TiO2. Water absorption decreases considerably with increasing filler content. With 30 wt% (20.2 vol%) SiO2 addition, the water absorption of the hybrid film reduces by 85% from that of pure polyimide.

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Authors and Affiliations

  1. Department of Materials and Mineral Resources Engineering, National Taipei University of Technology, 1, Sec. 3, Chung-Hsiao E. Rd., Taipei 106, Taiwan, ROC

    Sea-Fue Wang, Yuh-Ruey Wang & Shih-Hsin Chen

  2. Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, 1, Sec. 3, Chung-Hsiao E. Rd., Taipei 106, Taiwan

    Kuo-Chung Cheng

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  1. Sea-Fue Wang
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Correspondence to Sea-Fue Wang.

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Wang, SF., Wang, YR., Cheng, KC. et al. Physical and electrical properties of polyimide/ceramic hybrid films prepared via non-hydrolytic sol–gel process. J Mater Sci: Mater Electron 21, 104–110 (2010). https://doi.org/10.1007/s10854-009-9876-5

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