Skip to main content
SpringerLink
Log in

Fabrication and microstructures of sequentially electroplated Au-rich, eutectic Au/Sn alloy solder

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

An Au-rich, eutectic Au/Sn alloy was fabricated by sequential electroplating of Au and Sn, and reflowing the as-deposited Au/Sn/Au triple-layer film at 320–350 °C. Microstructures and phase compositions for the as-deposited Au/Sn/Au triple-layer film and the reflowed Au-rich, eutectic Au/Sn alloys were studied. Two Si wafers, each with the Au-rich, eutectic Au/Sn alloy solder, were bonded together. For the deposited Au/Sn/Au triple-layer film, reaction between Au and Sn occurs at room temperature leading to the formation of AuSn and AuSn4. After reflowing at 320 °C, two phases remain, AuSn and Au5Sn, with the AuSn particles distributed randomly in the Au5Sn matrix. There are also some micropores and microcracks in the reflowed alloy. If the annealing temperature is increased to 350 °C, the Au/Sn alloy is denser and contains fewer micropores. However, microcracks remain, forming preferentially along the Au5Sn/AuSn interface. After reflowing at 320 °C under a pressure of 13 kPa, two Si wafers are joined using the Au-rich, eutectic Au/Sn alloy solder. The solder is in intimate contact with the Si wafers; however, there are some micropores within the solder. After reflowing at 350 °C, the bond is quite good, without microcracks or micropores at the Si wafer/solder interface or within the solder.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  1. Z.H. Zhu, F.E. Ejeckam, Y. Qian, J. Zhang, Z. Zhang, G.L. Christson, Y.H. Lo IEEE J. Sel. Top. Quant. Electr. 3, 927 (1997)

    Article  CAS  Google Scholar 

  2. M.A. Schmidt, Proc. IEEE, 86, 1575 (1998)

    Article  CAS  Google Scholar 

  3. B. Djurfors, D.G. Ivey, Mater. Sci. Eng. B, 90, 309 (2002)

    Article  Google Scholar 

  4. B. Djurfors, D.G. Ivey, J. Electron. Mater. 30, 1249 (2001)

    Article  CAS  Google Scholar 

  5. D.G. Ivey, Micron, 29, 281 (1998)

    Article  CAS  Google Scholar 

  6. R.R. Chromik, D.N. Wang, A. Shugar, L. Limata, M.R. Notis, R.P. Vinci, J. Mater. Res. 20, 2161 (2005)

    Article  CAS  Google Scholar 

  7. W. Sun, D.G. Ivey, U. S. Patent 6, 245, 208 (2001)

    Google Scholar 

  8. J.Y. Tsai, C.W. Chang, C.E. Ho, Y.L. Lin, C.R. Kao, J. Electron. Mater. 35, 65 (2006)

    Article  CAS  Google Scholar 

  9. W. Sun, D.G. Ivey, J. Mater. Sci. 36, 757 (2001)

    Article  CAS  Google Scholar 

  10. J. Doesburg, D.G. Ivey, Plat. Surf. Finish. 88, 78 (2001)

    Google Scholar 

  11. A. He, Q. Liu, D.G. Ivey, J. Mater. Sci.: Mater. Electron. 17, 63 (2006)

    Article  CAS  Google Scholar 

  12. A. He, Q. Liu, D.G. Ivey, Plat. Surf. Finish. 92, 30 (2005)

    CAS  Google Scholar 

  13. W. Sun, D.G. Ivey, Mater. Sci. Eng. B 65, 111 (1999)

    Article  Google Scholar 

  14. J. Kim, C.C. LEE, Mater. Sci. Eng. A 417, 143 (2006)

    Article  Google Scholar 

  15. W.M. Tang, A.Q. He, Q. Liu, D.G. Ivey, J. Electron. Mater., Submitted

  16. G. Matjasevic, Thin Solid Films 223, 276 (1993)

    Article  Google Scholar 

  17. S. Nakahara, R.J. McCoy, L. Buene, J.M. Vandenberg, Thin Solid Films 84, 185 (1981)

    Article  CAS  Google Scholar 

  18. R. Novakovic, E. Ricci, F. Gnecco, D. Giurnno, G. Borzone, Surface Sci, 599, 230 (2005)

    Article  CAS  Google Scholar 

  19. E. Gebhardt, M. Becker, K. Kostin, Z. Metallkunde 47, 684 (1956)

    CAS  Google Scholar 

  20. O.E. Awe, O. Akinlade, L.A. Hussain, Surface Sci. 600, 2122 (2006)

    Article  CAS  Google Scholar 

  21. C.K. Saw, W.J. Siekhaus, Scripta Mater. 53, 1153 (2005)

    Article  CAS  Google Scholar 

  22. S. Pitely, L. Zavalij, S. Zarembo, E.J. Cotts, Scripta Mater. 51, 745 (2004)

    Article  CAS  Google Scholar 

  23. Y.Q. Fu, N.K.A. Bryan, Opt. Express 10, 540 (2002)

    CAS  Google Scholar 

Download references

Acknowledgments

The authors wish to thank the Natural Sciences and Engineering Research Council (NSERC) of Canada and Micralyne Inc. for providing research funding and Si substrates for electroplating (Micralyne). The first author would also like to thank the China Scholarship Council (CSC) and Hefei University of Technology, China, for financial support for studying abroad, as well as graduate students Weifeng Wei, Chunfen Han, Nima Shaigan and Sarah Zhou for their helpful discussion and cooperation.

Author information

Authors and Affiliations

  1. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada, T6G 2G6

    Wenming Tang, Anqiang He, Qi Liu & Douglas G. Ivey

Authors
  1. Wenming Tang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Anqiang He
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Qi Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Douglas G. Ivey
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Douglas G. Ivey.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Tang, W., He, A., Liu, Q. et al. Fabrication and microstructures of sequentially electroplated Au-rich, eutectic Au/Sn alloy solder. J Mater Sci: Mater Electron 19, 1176–1183 (2008). https://doi.org/10.1007/s10854-007-9522-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-007-9522-z

Keywords

Search

Navigation