Abstract
Development of polymer-based composites with simultaneously high thermal conductivity and breakdown strength has attracted considerable attentions owing to their important applications in both electronic and electric industries. In this study, we successfully design novel epoxy-based composites with nano-Al2O3/epoxy composite layer sandwiched between micro-Al2O3/epoxy composite layers, which show synergistically and significantly enhanced thermal conductivity and breakdown strength. Compared with the traditional composites, the bottleneck that both thermal conductivity and breakdown strength cannot be simultaneously enhanced can be overcome successfully. An optimized sandwiched alumina–epoxy composite with 70 wt% micro-Al2O3 fillers in the outer layers and 3 wt% nano-Al2O3 in the middle layer simultaneously displays a high thermal conductivity of 0.447 W m−1 K−1 (2.4 times of that of epoxy) and a high breakdown strength of 68.50 kV mm−1, which is 6.3 % higher than that of neat epoxy (64.45 kV mm−1). The experimental results on the thermal conductivity of multi-layered alumina–epoxy composites were in well accordance with the theoretical values predicted from the series conduction model. This novel technique simultaneously improves thermal conductivity and breakdown strength, which is of critical importance for design of perspective composites for electronic and electric equipments.
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Acknowledgements
The authors thank the colleagues in the laboratory of International Center for Dielectric Research for their support. We thank the Center of Advancing Materials Performance (CAMP-Nano) for providing the SEM, and Dr. Zhaoyang Fan for his help with the SEM operation. This work was financially supported by the National Science Foundation of China (Innovative Research Group, No. 51221005).
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Wang, Z., Cheng, Y., Wang, H. et al. Sandwiched epoxy–alumina composites with synergistically enhanced thermal conductivity and breakdown strength. J Mater Sci 52, 4299–4308 (2017). https://doi.org/10.1007/s10853-016-0511-6
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DOI: https://doi.org/10.1007/s10853-016-0511-6