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Formicary-like carbon nanotube/copper hybrid nanostructures for carbon fiber-reinforced composites by electrophoretic deposition

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Abstract

An electrophoretic deposition process has been applied to produce unique carbon nanotube (CNT)/copper nanostructures on the carbon fiber surfaces. During the deposition process, ionized copper and positively charged CNTs are accelerated towards the carbon fiber under applied electric fields. An interconnected formicary-like network of nanotubes and nanoparticles is formed where copper nucleation and growth occurs predominantly at nanotube crossing and edge-contact locations. When embedded in a structural composite the CNT/copper structures create a highly conductive and strongly bonded network shown by significant enhancements in both electrical conductivity and interlaminar shear strength as compared to composites without the CNT/copper nanostructures.

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Acknowledgements

This work was supported by the Korea Foundation for International Cooperation of Science & Technology (KICOS) through a Grant provided by the Korean Ministry of Education, Science & Technology (MEST) in 2007 (No. K20704000090) and also supported by the Principal Research Program in the Korea Institute of Materials Science (KIMS).

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Authors and Affiliations

  1. Composite Materials Research Group, Korea Institute of Materials Science, 797 Changwon-daero, Changwon, Gyeongnam, 641-831, South Korea

    Wonoh Lee, Sang-Bok Lee, Oyoung Choi, Jin-Woo Yi, Moon-Kwang Um & Joon-Hyung Byun

  2. Department of Mechanical Engineering, Center for Composite Materials, University of Delaware, Newark, DE, 19716, USA

    Erik T. Thostenson & Tsu-Wei Chou

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  1. Wonoh Lee
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  2. Sang-Bok Lee
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  4. Jin-Woo Yi
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  6. Joon-Hyung Byun
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  7. Erik T. Thostenson
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  8. Tsu-Wei Chou
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Correspondence to Joon-Hyung Byun.

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Lee, W., Lee, SB., Choi, O. et al. Formicary-like carbon nanotube/copper hybrid nanostructures for carbon fiber-reinforced composites by electrophoretic deposition. J Mater Sci 46, 2359–2364 (2011). https://doi.org/10.1007/s10853-010-5082-3

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  • DOI: https://doi.org/10.1007/s10853-010-5082-3

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