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Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder joints

  • Proceedings of the IV International Conference High Temperature Capillarity
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Abstract

The relationship between wetting behavior, interface structure and mechanical properties of solder/substrate couples has been studied on example of Sn-alloys and Cu substrates. The sessile drop method was used to investigate the solder wetting and spreading on polished Cu substrates in vacuum at a temperature of 503 K. The sessile drop samples after solidification were bisected perpendicularly to the substrate at the mid-plane of the contact circle. The first half of each sample was used for structural characterization of interfaces and evaluation of their mechanical properties by improved push-off shear test. The second half was used for investigation of the effect of thermocycling on structural stability and corresponding mechanical behavior of model solder/Cu joints. A comparison with the results obtained on standard solder joints has shown the usefulness of the improved push-off shear test performed directly on solidified sessile drop samples as an express test for evaluation of technological and mechanical compatibility of solder/substrate couples, particularly at the first stage of solder candidate selection.

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References

  1. N. SOBCZAK, R. ASTHANA, M. KSIAZEK, W. RADZIWILL, B. MIKULOWSKI and I. SUROWIAK, in State of Art in Cast Metal Matrix Composites in the Next Millennium, edited by P. K. Rohatgi (TMS Publications, Pennsylvania, USA, 2000) p. 129.

  2. N. SOBCZAK, L. STOBIERSKI, M. KSIAZEK, W. RADZIWILL, J. MORGIEL and B. MIKULOWSKI, Trans. JWRI, 30 (2001) 39.

    CAS  Google Scholar 

  3. N. SOBCZAK, Kompozyty 3(7) (2003) 301.

    CAS  Google Scholar 

  4. N. SOBCZAK, R. ASTHANA, M. KSIAZEK, W. RADZIWILL and B. MIKULOWSKI, Metall. Mater. Trans. 35A(3) (2004) 911.

    Article  CAS  Google Scholar 

  5. N. SOBCZAK, M. KSIAZEK, W. RADZIWILL, L. STOBIERSKI and B. MIKULOWSKI, Trans. JWRI 30 (2001) 125.

    CAS  Google Scholar 

  6. N. SOBCZAK, Ceramic Transactions, 146 (2004) 83.

    Google Scholar 

  7. N. SOBCZAK, K. NOGI, H. FUJII, T. MATSUMOTO, K. TAMADA and R. ASTHANA, in Joining of Advanced & Specialty Materials, edited by J. E. Indacochea, J. N. Dupont, T. J. Lienert, W. Tillmann, N. Sobczak, W. F. Gale and M. Singh (ASM International, Materials Park, OH, 2003) p. 108.

  8. M. KSIAZEK, N. SOBCZAK, B. MIKULOWSKI and W. RADZIWILL, Ceramic Transactions p. 96.

  9. J. GALON, N. SOBCZAK and R. RYGLICKI, Patent of Poland No PL 50513 (28.10.1988).

  10. K. N. SUBRAMANIAN and J. G. LEE, JOM, 5 (2003) 26.

    Article  Google Scholar 

  11. W. B. Hampshire, in Proc. Surface Mount International Conf. (San Jose, CA, 1992) p. 729.

  12. T. SIEWERT, S. LIU, D. R. SMITH and J. C. MADENI, “Database for Solder Properties with Emphasis on New Lead-Free Solders, Properties of Lead-Free Solders, Release 4.0” (National Institute of Standards and Technologies and Colorado School of Mines, Colorado, Feb. 11, 2002).

  13. C.-W. HWANG, K. SUGANUMA, E. SAIZ and A. P. TOMSIA, Trans. JWRI 30 (2001) 167.

    CAS  Google Scholar 

  14. N. SOBCZAK, J. JANCZAK-RUSCH, P. SHEBO, A. MIKULA, L. B. DRENCHEV, P. SHEBO, W. PLUMBRIDGE and J. BOTSIS, Group Project No. 7: Prediction of New Generation Solders, COST Action 531: Lead-Free Solder Materials.

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Authors and Affiliations

  1. Foundry Research Institute, 73 Zakopianska Street, 30-418, Cracow, Poland

    N. SOBCZAK, J. SOBCZAK, R. NOWAK, A. KUDYBA, P. DARLAK, B. MIKULOWSKI & A. WOJCIECHOWSKI

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  1. N. SOBCZAK
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  2. J. SOBCZAK
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  3. R. NOWAK
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  4. A. KUDYBA
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  5. P. DARLAK
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  6. B. MIKULOWSKI
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  7. A. WOJCIECHOWSKI
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Correspondence to N. SOBCZAK.

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SOBCZAK, N., SOBCZAK, J., NOWAK, R. et al. Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder joints. J Mater Sci 40, 2547–2551 (2005). https://doi.org/10.1007/s10853-005-1990-z

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  • DOI: https://doi.org/10.1007/s10853-005-1990-z

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