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Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process

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Abstract

This article presents an experimental investigation to obtain the uniform tool tips of the worn tools’ after the electrochemical discharge machining (ECDM) processing using electrochemical machining process (ECM). Usage of multi-tip array tool electrodes in the ECDM process to fabricate microarray holes improves the process productivity; however, due to the non-uniform tool wear, these multi-tip array tools have limited reusability. The ECM experiments were performed at a constant voltage of 8 V, 10% sulphuric acid as the electrolyte medium, and spherical shaped electrode as the cathode. Initially, a comparative analysis between continuous DC power supply and pulse DC power supply was investigated to evaluate the dissolution behavior of the array tool electrode. The influence of pulse frequency and duty cycle on the reduction of tip length and size was also investigated. The experimental results found that the pulse frequency of 50 kHz and 30% duty cycle exhibited the most appropriate combination for uniform dissolution of the 3 × 3 array tool electrode. Further, a case study was also performed to evaluate the performance of the 3 × 3 array tool electrode for the ECDM applications using the array tool electrode made using continuous DC and pulse DC power supplies.

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References

  1. Kannojia HK, Sidhique A, Shukla AS, et al (2021) Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate. Microsyst Technol. https://doi.org/10.1007/s00542-021-05244-x.

    Article  Google Scholar 

  2. Kim C, Yoon Y-K (2013) High frequency characterization and analytical modeling of through glass via (TGV) for 3D thin-film interposer and MEMS packaging. In: Proceedings of the 2013 IEEE 63rd Electronic Components and Technology Conference. IEEE, pp 1385–1391

  3. Ogutu P, Fey E, Dimitrov N (2015) Superconformal filling of high aspect ratio through glass vias (TGV) for interposer applications using TNBT and NTBC additives. J Electrochem Soc 162:D457–D464

    Article  CAS  Google Scholar 

  4. Jain VK, Choudhury SK, Ramesh KM (2002) On the machining of alumina and glass. Int J Mach Tools Manuf 42:1269–1276

    Article  Google Scholar 

  5. Nikumb S, Chen Q, Li C, et al (2005) Precision glass machining, drilling and profile cutting by short pulse lasers. Thin Solid Films 477:216–221

    Article  CAS  Google Scholar 

  6. Arab J, Mishra DK, Kannojia HK, et al (2019) Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging. J Mater Process Technol 271:542–553

    Article  CAS  Google Scholar 

  7. Jain VK, Dixit PM, Pandey PM (1999) On the analysis of the electrochemical spark machining process. Int J Mach Tools Manuf 39:165–186

    Article  Google Scholar 

  8. Singh T, Dvivedi A (2016) Developments in electrochemical discharge machining: a review on electrochemical discharge machining, process variants and their hybrid methods. Int J Mach Tools Manuf 105:1–13

    Article  Google Scholar 

  9. Mishra DK, Arab J, Magar Y, Dixit P (2019) High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique. ECS J Solid State Sci Technol 8:P322–P331

    Article  CAS  Google Scholar 

  10. Singh T, Dvivedi A, Arya RK (2019) Fabrication of micro-slits using W-ECDM process with textured wire surface: an experimental investigation on kerf overcut reduction and straightness improvement. Precis Eng 59:211–223

    Article  Google Scholar 

  11. Mishra DK, Pawar K, Dixit P (2020) Effect of tool electrode-workpiece gap in the microchannel formation by electrochemical discharge machining. ECS J Solid State Sci Technol 9:34011

    Article  Google Scholar 

  12. Singh T, Dvivedi A (2018) On performance evaluation of textured tools during micro-channeling with ECDM. J Manuf Process 32:699–713

    Article  Google Scholar 

  13. Mishra DK, Verma AK, Arab J, et al (2019) Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining. J Micromech Microeng 29:75004

    Article  CAS  Google Scholar 

  14. Kannojia HK, Arab J, Pegu BJ, Dixit P (2019) Fabrication and characterization of through-glass vias by the ECDM process. J Electrochem Soc 166:D531–D538

    Article  CAS  Google Scholar 

  15. Arab J, Mishra DK, Dixit P (2020) Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling. Measurement 168:108463. https://doi.org/10.1016/j.measurement.2020.108463

    Article  Google Scholar 

  16. Mishra DK, Dixit P (2021) Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process. J Manuf Process 72:93–104

    Article  Google Scholar 

  17. Jain VK, Kalia S, Sidpara A, Kulkarni VN (2012) Fabrication of micro-features and micro-tools using electrochemical micromachining. Int J Adv Manuf Technol 61:1175–1183

    Article  Google Scholar 

  18. Lim Y-M, Kim SH (2001) An electrochemical fabrication method for extremely thin cylindrical micropin. Int J Mach Tools Manuf 41:2287–2296

    Article  Google Scholar 

  19. Fan Z-W, Hourng L-W (2009) The analysis and investigation on the microelectrode fabrication by electrochemical machining. Int J Mach Tools Manuf 49:659–666

    Article  Google Scholar 

  20. Mathew R, Sundaram MM (2012) Modeling and fabrication of micro tools by pulsed electrochemical machining. J Mater Process Technol 212:1567–1572

    Article  CAS  Google Scholar 

  21. Bhattacharyya B, Munda J, Malapati M (2004) Advancement in electrochemical micro-machining. Int J Mach Tools Manuf 44:1577–1589

    Article  Google Scholar 

  22. Bhattacharyya B, Doloi B, Sridhar PS (2001) Electrochemical micro-machining: new possibilities for micro-manufacturing. J Mater Process Technol 113:301–305

    Article  Google Scholar 

  23. Patro SK, Mishra DK, Arab J, Dixit P (2020) Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining. J Appl Electrochem 50:169–184

    Article  CAS  Google Scholar 

  24. Kumar A, Das M (2021) Multiphysics simulation and experimental investigation of microtool fabricated by EMM. Mater Manuf Process 36(13):1489–1500. https://doi.org/10.1080/10426914.2021.1905837

    Article  Google Scholar 

  25. Ghoshal B, Bhattacharyya B (2013) Influence of vibration on micro-tool fabrication by electrochemical machining. Int J Mach Tools Manuf 64:49–59

    Article  Google Scholar 

  26. Wang MH, Zhu D (2009) Fabrication of multiple electrodes and their application for micro-holes array in ECM. Int J Adv Manuf Technol 41:42–47

    Article  Google Scholar 

  27. Wang M, Bao Z, Wang X, Xu X (2016) Fabrication of disk microelectrode arrays and their application to micro-hole drilling using electrochemical micromachining. Precis Eng 46:184–192

    Article  Google Scholar 

  28. Mishra DK, Singh T, Dixit P (2021) Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications. Mater Manuf Process. https://doi.org/10.1080/10426914.2021.2001520

    Article  Google Scholar 

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Acknowledgements

Tarlochan Singh is supported by the Institute Postdoctoral Fellowship of IIT Bombay. The authors would like to acknowledge the financial support from the Ministry of Human Resources and Development (MHRD) and the Department of Scientific and Industrial Research (DSIR) through (DSIR/PACE/TDD-IMPRINT/7510). This work has been carried out as a part of the Impacting Research Innovation and Technology (Imprint) Project, initiated by MHRD, Indian Government, under the Research Grant 10007457.

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  1. Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, 400076, India

    Tarlochan Singh, Dileep Kumar Mishra & Pradeep Dixit

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  1. Tarlochan Singh
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  2. Dileep Kumar Mishra
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  3. Pradeep Dixit
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Correspondence to Dileep Kumar Mishra.

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Singh, T., Mishra, D.K. & Dixit, P. Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process. J Appl Electrochem 52, 667–682 (2022). https://doi.org/10.1007/s10800-021-01662-x

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