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Electrodeposition of Cu from acidic sulphate solutions containing cetyltrimethylammonium bromide (CTAB)

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Abstract

In this paper we report a study of the electrodeposition of Cu from an acidic sulphate solution containing cetyltrimethylammonium bromide (CTAB). This investigation is based on cyclic voltammetry, in situ surface-enhanced Raman spectroscopy (SERS), Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM). Adsorption of CTAB over a wide range of cathodic potentials was proved spectroelectrochemically, encompassing both conditions where compact and loose Cu grows (up to −0.4 and between −0.4 and −1 V vs. Ag/AgCl, respectively). Furthermore, we found that CTAB tends to react cathodically, undergoing the loss of the aliphatic tail at lower cathodic potentials and the formation of an allylic product at higher polarisations. CTAB deeply impacts the Cu growth mode: ordered ridges of compact Cu crystallites form at low cathodic potentials—where the electrodeposition process is strongly inhibited by CTAB adsorption—and nanoparticles grow under hydrogen-evolution conditions.

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References

  1. Franklin TC (1986) J Electrochem Soc 133:893

    Article  CAS  Google Scholar 

  2. Franklin TC (1988) J Electrochem Soc 135:1638

    Article  CAS  Google Scholar 

  3. Schweinsberg DP, Ashworth V (1988) Corr Sci 28:539

    Article  CAS  Google Scholar 

  4. Cachet C, Wiart R, Ivanov I, Stefanov Y, Rashkov S (1994) J Appl Electrochem 24:713

    Article  CAS  Google Scholar 

  5. Zvauya R, Dawson JL (1994) J Appl Electrochem 24:943

    Article  CAS  Google Scholar 

  6. Muralidharan S, Iyer SVK, Vasudevan T, Alwarappan S (1995) Corr Sci 37:1235

    Article  Google Scholar 

  7. Tripathy BC, Das SC, Hefter GT, Singh P (1998) J Appl Electrochem 28:915

    Article  CAS  Google Scholar 

  8. Narayanan TSNS (1999) Metal Finishing 6:94

    Google Scholar 

  9. Bozzini B, Fanigliulo A, Serra M (2001) J Cryst Growth 231:589

    Article  CAS  Google Scholar 

  10. Bizzotto D, Zamlynny V, Burgess I, Jeffrey CA, Li HQ, Rudinstein J, Merril RA, Lipkowski J, Galus Z, Nelson A, Pettinger B (1999) In: Wieckowski A (ed) Interfacial electrochemistry–theory, experiment, applications. Marcel Dekker, New York

    Google Scholar 

  11. Bartlett PN (2004) Interface 13:28

    Google Scholar 

  12. Reetz MT, Helbig W (1994) J Am Chem Soc 116:7401

    Article  CAS  Google Scholar 

  13. Becker JA, Schäfer R, Festag W (1995) J Chem Phys 103:2520

    Article  CAS  Google Scholar 

  14. Reetz MT, Helbig W, Quaiser SA (1995) Chem Mater 7:2227

    Article  CAS  Google Scholar 

  15. Reetz MT, Quaiser SA (1995) Angew Chem Int Ed Engl 34:2240

    Article  CAS  Google Scholar 

  16. Kolb U, Quaiser SA, Winter M, Reetz MT (1996) Chem Mater 8:1889

    Article  CAS  Google Scholar 

  17. Reetz MT, Helbig W, Quaiser SA (1996) In: Fürstner A (ed) Active metals. VCH, Weinheim

    Google Scholar 

  18. Reetz MT, Quaiser SA, Merk C (1996) Chem Ber 129:741

    Article  CAS  Google Scholar 

  19. Kang KH, Kim HU, Lim KH (2001) Colloids Surf A 189:113

    Article  CAS  Google Scholar 

  20. Bozzini B, D’Urzo L, Mele C (2007) Electrochim Acta 52:4767

    Article  CAS  Google Scholar 

  21. Lee HP, Nobe K (1986) J Electrochem Soc 133:2035

    Article  CAS  Google Scholar 

  22. Abrantes LM, Araùjo LM, Levi M (1995) Min Eng 8:1467

    Article  CAS  Google Scholar 

  23. Drissi-Daoudi R, Irzho A, Darchen A (2003) J Appl Electrochem 33:339

    Article  CAS  Google Scholar 

  24. Bozzini B, Busson B, De Gaudenzi GP, D’Urzo L, Mele C, Tadjeddine A (2007) Corr Sci 49:2392

    Article  CAS  Google Scholar 

  25. Montalvo G, Valiente M, Rodenas E (1995) J Colloids Interface Sci 172:494

    Article  CAS  Google Scholar 

  26. Bozzini B, Romanello V, Mele C, D’Urzo L (2008) J Phys Chem C 112:6352

    Article  CAS  Google Scholar 

  27. Bozzini B, Giovannelli G, Cavallotti PL (1999) J Appl Electrochem 29:687

    Article  Google Scholar 

  28. Bozzini B, Mele C, Fanigliulo A, Busson B, Vidal F, Tadjeddine A (2004) J Electroanal Chem 574:85

    Article  CAS  Google Scholar 

  29. Colthup NB, Daly LH, Wiberley SE (1990) Introduction to infrared and Raman spectroscopy. Academic Press, Boston

    Google Scholar 

  30. Isaacs NS (1987) Physical organic chemistry. John Wiley & Sons, New York

    Google Scholar 

  31. Bozzini B, Romanello V, De Gaudenzi GP (2006) Trans Inst Met Fin 84:154

    Article  CAS  Google Scholar 

Download references

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Authors and Affiliations

  1. Dipartimento di Ingegneria dell’Innovazione, Università di Lecce, via Monteroni, 73100, Lecce, Italy

    Benedetto Bozzini & Lucia D’Urzo

  2. ENEA—Materials and Technology, Composite and Nanostructured Materials Section, C.R. Brindisi, S.S. 7 Appia – km 706, 72100, Brindisi, Italy

    Marilena Re & Federica De Riccardis

Authors
  1. Benedetto Bozzini
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  2. Lucia D’Urzo
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  3. Marilena Re
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  4. Federica De Riccardis
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Correspondence to Benedetto Bozzini.

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Bozzini, B., D’Urzo, L., Re, M. et al. Electrodeposition of Cu from acidic sulphate solutions containing cetyltrimethylammonium bromide (CTAB). J Appl Electrochem 38, 1561–1569 (2008). https://doi.org/10.1007/s10800-008-9598-z

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  • DOI: https://doi.org/10.1007/s10800-008-9598-z

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