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Effect of ascorbic acid on mild steel dissolution in sulphuric acid solution investigated by electrochemical polarization and surface probe techniques

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Abstract

The effect of ascorbic acid (AA) on the corrosion of mild steel in sulphuric acid solution has been investigated by open circuit potential (OCP) and polarization measurements. AA was observed to shift the OCP to more positive potentials with increasing concentration. The polarization curves revealed that AA inhibited the anodic metal dissolution reaction, although this effect became negligible at high anodic overpotentials. The trend of inhibition efficiency with concentration showed that efficiency increased rapidly at low concentrations, remained almost steady at intermediate concentrations and increased again at high concentrations. The mechanism of inhibition was considered in terms of initial chemisorption of AA according to the Temkin isotherm, followed by formation of chelate compounds with Fe2+ ions at high concentrations. EDS and AFM analyses of the electrode surface support the proposed inhibition mechanisms.

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Acknowledgements

E. E. Oguzie is grateful to the Chinese Academy of Sciences (CAS) and the Academy of Sciences for the Developing World (TWAS) for the award of CAS-TWAS Fellowship.

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Authors and Affiliations

  1. State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, 62 Wencui Road, Shenyang, 110016, China

    E. E. Oguzie, Y. Li & F. H. Wang

  2. Electrochemistry and Materials Science Research Laboratory, Department of Chemistry, Federal University of Technology Owerri, PMB 1526, Owerri, Nigeria

    E. E. Oguzie

Authors
  1. E. E. Oguzie
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  2. Y. Li
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  3. F. H. Wang
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Correspondence to Y. Li.

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Oguzie, E.E., Li, Y. & Wang, F.H. Effect of ascorbic acid on mild steel dissolution in sulphuric acid solution investigated by electrochemical polarization and surface probe techniques. J Appl Electrochem 37, 1183–1190 (2007). https://doi.org/10.1007/s10800-007-9384-3

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  • DOI: https://doi.org/10.1007/s10800-007-9384-3

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