Skip to main content
SpringerLink
Log in

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

  • Published:
Journal of Applied Electrochemistry Aims and scope Submit manuscript

Abstract

DC and pulse plating of copper in acidic sulphate solutions containing benzotriazole (BTA) has been studied. When BTA is the only additive present, it generally has a stronger effect than the plating mode and significantly enhances deposit morphology and surface brightness over that produced in additive-free solutions. XPS and voltammetry analyses indicate that BTA is present at the surface of the deposit, but not through the entire coating, and does not become depleted within the solution over the course of plating. This may help explain why the initial surface smoothness and brightness is maintained as the coating grows beyond 5 μm thick. Plating mode does have a strong effect on deposit morphology under specific conditions. Pulse current plating at low frequency (50 Hz) and low duty cycle (20%) produces deposits with poorer quality than that obtained by DC plating. Pulse reverse plating yields very coarse and dull coatings when the frequency is low enough for metal dissolution to occur during the reverse time. Regardless of the plating mode, the addition of Cl− eliminates most of the beneficial effects of BTA and leads to very rough and dull deposits. The observed effects are discussed in light of previous research on the electrodeposition and corrosion of the Cu–BTA and Cu–BTA–Cl systems.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. 1. Ibl N., Puippe J.Cl., Angerer H. (1978) a. Surf. Technol. 6: 287–300

    Article  CAS  Google Scholar 

  2. 2. Holmbom G., Jacobson B.E. (1988) aaaa. J Electrochem. Soc. 135: 2720–2725

    Article  CAS  Google Scholar 

  3. 3. El-Sherik A.M., Erb U., Page J. (1996) aaa. Surf. Coat. Technol. 88: 70–78

    Article  Google Scholar 

  4. 4. Roy S., Landolt D. (1997) as. J Appl. Electrochem. 27: 299–307

    Article  CAS  Google Scholar 

  5. 5. Kristof P., Pritzker M. (1998) a. Plat. Surf. Finish. 85: 237–241

    CAS  Google Scholar 

  6. 6. Turner D.R., Johnson G.R. (1962) aa. J Electrochem. Soc. 109: 798–804

    Article  CAS  Google Scholar 

  7. 7. Pletcher D., Walsh F. (1990) Industrial Electrochemistry. Chapman and Hall, New York

    Google Scholar 

  8. 8. Schmidt W.U., Alkire R.C., Gewirth A.A. (1996) aa. J Electrochem. Soc. 143: 3122–3132

    Article  CAS  Google Scholar 

  9. 9. Andricacos P.C. (1999) aa. Electrochem. Soc. Interface 8: 32–36

    CAS  Google Scholar 

  10. 10. Datta M., Landolt D. (2000) a. Electrochim. Acta 45: 2535–2558

    Article  CAS  Google Scholar 

  11. 11. Leung T.Y.B., Kang M., Corry B.F., Gewirth A.A. (2000) as. J. Electrochem. Soc. 147: 3326–3337

    Article  CAS  Google Scholar 

  12. 12. Moffatt T.P., Bonevich J.E., Huber W.H., Stanishevsky A., Kelly D.R., Stafford G.R., Josell D. (2000) ad. J. Electrochem. Soc. 147: 4524–4535

    Article  Google Scholar 

  13. 13. Prall J.K., Shreir L.L. (1964) a. Trans. Inst. Metal Finish. 41: 29–39

    CAS  Google Scholar 

  14. 14. Walker R. (1970) a. Plating 57: 610–614

    CAS  Google Scholar 

  15. 15. Walker R., Benn R.C. (1971) aa. Electrochim. Acta 16: 1081–1088

    Article  CAS  Google Scholar 

  16. 16. Sheshadri B.S. (1975) a. J. Electroanal. Chem. Interfac. Electrochem. 61: 353–360

    CAS  Google Scholar 

  17. 17. Armstrong M.J., Muller R.H. (1991) a. J. Electrochem. Soc. 138: 2303–2307

    Article  CAS  Google Scholar 

  18. 18. Rynders R.M., Alkire R.C. (1994) a. J. Electrochem. Soc. 141: 1166–1173

    Article  CAS  Google Scholar 

  19. 19. Farndon E.E., Walsh F.C., Campbell S.A. (1995) a. J. Appl. Electrochem. 25: 574–583

    Article  CAS  Google Scholar 

  20. 20. Scendo M., Malyszko J. (2000) da. J. Electrochem. Soc. 147: 1758–1762

    Article  CAS  Google Scholar 

  21. 21. Kim J.J., Kim S.-K., Bae J.-U. (2002) a. Thin Solid Films 415: 101–107

    Article  CAS  Google Scholar 

  22. 22. Lin K.C., Shieh J.M., Chang S.C., Dai B.T., Chen C.F., Feng M.S., Li Y.H. (2002) a. J. Vac. Sci. Technol. B 20: 2233–2237

    Article  CAS  Google Scholar 

  23. 23. Kang M., Gross M.E., Gewirth A.A. (2003) a. J. Electrochem. Soc. 150: C292–C301

    Article  CAS  Google Scholar 

  24. 24. Wu A., Barkey D.P. (2003) aa. J. Electrochem. Soc. 150: C533–C537

    Article  CAS  Google Scholar 

  25. 25. Poling G.W. (1970) a. Corros. Sci. 10: 359–370

    Article  CAS  Google Scholar 

  26. 26. Mansfield F.B., Smith T., Parry E.P. (1971) aa. Corrosion 27: 289–293

    Google Scholar 

  27. 27. Youda R., Nishihara H., Aramaki K. (1988) a. Corros. Sci. 28: 87–96

    Article  CAS  Google Scholar 

  28. 28. Cohen S.L., Brusic V.A., Kaufman F.B., Frankel G.S., Motakef S., Rush B. (1990) aa. J. Vac. Sci. Technol. A 8: 2417–2424

    Article  CAS  Google Scholar 

  29. 29. Brusic V.A., Frisch M.A., Eldridge B.N., Novak F.P., Kaufman F.B., Rush B.M., Frankel G.S. (1991) aa. J. Electrochem. Soc. 138: 2253–2259

    Article  CAS  Google Scholar 

  30. 30. Tromans D., Sun R.H. (1991) a. J. Electrochem. Soc. 138: 3235–3244

    Article  CAS  Google Scholar 

  31. 31. Wu Y.C., Zhang P., Pickering H.W., Allara D.L. (1993) aa. J. Electrochem. Soc. 140: 2791–2800

    Article  CAS  Google Scholar 

  32. 32. Vogt M.R., Polewska W., Magnussen O.M., Behm R.J. (1997) aas. J. Electrochem. Soc. 144: L113–L116

    Article  CAS  Google Scholar 

  33. 33. Vogt M.R., Nichols R.J., Magnussen O.M., Behm R.J. (1998) aa. J. Phys. Chem. B 102: 5859–5865

    Article  CAS  Google Scholar 

  34. 34. Chan H.Y.H., Weaver M.J. (1999) aa. Langmuir 15: 3348–3355

    Article  CAS  Google Scholar 

  35. 35. Rubim J., Gutz I.G.R., Sala O., Orville-Thomas W.J. (1983) aa. J. Mol. Struct. 100: 571–583

    Article  CAS  Google Scholar 

  36. 36. Biggin M.E., Gewirth A.A. (2001) a. J. Electrochem. Soc. 148: C339–C347

    Article  CAS  Google Scholar 

  37. 37. Yoon S., Schwartz M., Nobe K. (1994) a. Plat. Surf. Finish. 81(12): 65–74

    CAS  Google Scholar 

  38. 38. Pearson T., Dennis J.K. (1990) a. J. Appl. Electrochem. 20: 196–208

    Article  CAS  Google Scholar 

  39. 39. Kelly J.J., West A.C. (1998) a. J. Electrochem. Soc. 145: 3472–3476

    Article  CAS  Google Scholar 

  40. 40. Nagy Z., Blaudeau J.P., Hung N.C., Curtiss L.A., Zurawski D.J. (1995) aa. J. Electrochem. Soc. 142: L87–L89

    Article  CAS  Google Scholar 

  41. 41. Chène O., Landolt D. (1989) a. J. Appl. Electrochem. 19: 188–194

    Article  Google Scholar 

  42. 42. Pesco A.M., Cheh H.Y. (1989) a. J. Electrochem. Soc. 136: 408–414

    Article  CAS  Google Scholar 

  43. 43. Tantavichet N., Pritzker M.D. (2003) aa. J. Electrochem. Soc. 150: C665–C677

    Article  CAS  Google Scholar 

  44. S. Pizzini, K.J. Roberts, I. Dring, R.J. Oldman and G.N. Greaves, Conference Proceedings of the Italian Physics Society (1990) p. 525

  45. 45. Alkire R., Cangellari A. (1989) a. J. Electrochem. Soc. 136: 913–919

    Article  CAS  Google Scholar 

  46. 46. Tromans D. (1998) aa. J. Electrochem. Soc. 145: L42–L45

    Article  CAS  Google Scholar 

  47. 47. Barkey D.P., Oberholtzer F., Wu Q. (1998) aa. J. Electrochem. Soc. 145: 590–595

    Article  CAS  Google Scholar 

  48. 48. Hua D., Barkey D. (2003) aa. Plat. Surf. Finish. 90(7): 40–44

    Google Scholar 

  49. 49. Tromans D., Silva J.C. (1997) aa. Corros. Sci. 53: 16–25

    Article  CAS  Google Scholar 

Download references

Acknowledgements

The authors express their gratitude to the Natural Sciences and Engineering Research Council of Canada (NSERC) for financial support during the course of this study.

Author information

Author notes

  1. Nisit Tantavichet

    Present address: Department of Chemical Engineering, University of Waterloo, Waterloo, Ontario, Canada, N2L 3G1

Authors and Affiliations

  1. Department of Chemical Technology, Faculty of Science, Chulalongkorn University, Bangkok, Thailand

    Nisit Tantavichet

  2. Department of Chemical Engineering, University of Waterloo, Waterloo, Ontario, Canada, N2L 3G1

    Mark Pritzker

Authors
  1. Nisit Tantavichet
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Mark Pritzker
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Mark Pritzker.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Tantavichet, N., Pritzker, M. Copper electrodeposition in sulphate solutions in the presence of benzotriazole. J Appl Electrochem 36, 49–61 (2006). https://doi.org/10.1007/s10800-005-9000-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10800-005-9000-3

Keywords

Search

Navigation