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Three-dimensional asymptotic stress field in the vicinity of the circumference of a bimaterial penny-shaped interfacial discontinuity

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Abstract

An eigenfunction expansion method is presented to obtain three-dimensional asymptotic stress fields in the vicinity of the circumference of a bimaterial penny-shaped interfacial discontinuity, e.g., crack, anticrack (infinitely rigid lamella), etc., located at the center, edge or corner, and subjected to the far-field torsion (mode III), extension/bending (mode I), and sliding shear/twisting (mode II) loadings. Five different discontinuity-surface boundary conditions are considered: (1) bimaterial penny-shaped interface anticrack or perfectly bonded thin rigid inclusion, (2) bimaterial penny-shaped interfacial jammed contact, (3) bimaterial penny-shaped interface crack, (4) bimaterial penny-shaped interface crack with partial axisymmetric frictionless slip, and (5) bimaterial penny-shaped interface thin rigid inclusion alongside penny-shaped crack. Solutions to these cases except (3) are hitherto unavailable in the literature. Closed-form expressions for stress intensity factors subjected to various far-field loadings are also presented. Numerical results presented include the effect of the ratio of the shear moduli of the layer materials, and also Poisson’s ratios on the computed lowest real parts of eigenvalues for the case (5). Interesting and physically meaningful conclusions are also presented, especially with regard to cases (1) and (2).

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Authors and Affiliations

  1. Department of Materials Science and Engineering, University of Utah, Salt lake City, UT, 84112-0560, USA

    Reaz A. Chaudhuri

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  1. Reaz A. Chaudhuri
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Correspondence to Reaz A. Chaudhuri.

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Chaudhuri, R.A. Three-dimensional asymptotic stress field in the vicinity of the circumference of a bimaterial penny-shaped interfacial discontinuity. Int J Fract 141, 211–225 (2006). https://doi.org/10.1007/s10704-006-0076-5

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  • DOI: https://doi.org/10.1007/s10704-006-0076-5

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