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Flexibility analysis of a surface mount technology electronic assembly plant: An integrated model using simulation

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Abstract

This paper focuses on developing an integrated model using simulation to evaluate the effect of several independent variables on the performance of a surface mount technology (SMT) production line. Real data and an existing SMT line from a high product mix/low volume electronics manufacturer are used to conduct the analysis. The independent variables used are set-up formation policies (group technology based family grouping methods), machine feeder types, similarity factor in set-up formation, parts reduction at design step of products, and inter-families and intra-family scheduling rules. In addition, a new method of grouping products is proposed. The measures of performance evaluated by the model are average lead time, average work-in-process (WIP) inventory and average set-up time. Data analysis shows that the proposed method of grouping products will reduce set-up time and lead time while slightly increasing WIP. The proposed simulation model helps assess the effects of some of the independent variables on line performance. Recommendations are made in order to help the user choose the best alternative to improve production line productivity and flexibility.

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Lambert, S., Abdulnour, G., Drolet, J. et al. Flexibility analysis of a surface mount technology electronic assembly plant: An integrated model using simulation. Int J Flex Manuf Syst 17, 151–167 (2005). https://doi.org/10.1007/s10696-006-8125-y

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  • DOI: https://doi.org/10.1007/s10696-006-8125-y

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