Abstract
A novel method for fabricating a three-layer SU-8 mould with inverted T-shaped cavities is presented. The first two SU-8 layers were spin coated and exposed separately, and simultaneously developed to fabricate the bottom and the horizontal part of the inverted T-shaped cavity. Then, a positive photoresist was filled into the cavity, and a wet lapping process was performed to remove the excess photoresist and make a temporary substrate. The third SU-8 layer was spin coated on the temporary substrate to make the vertical part of the inverted T-shaped cavity. The sacrificial photoresist layer can prevent the first two SU-8 layers from being secondly exposed, and make a temporary substrate for the third SU-8 layer at the same time. Moreover, the photoresist can be easily removed with the development of the third SU-8 layer. A polydimethylsiloxane (PDMS) microchip with arrays of T-shaped cantilevers for studying the mechanics of cells was fabricated by using the SU-8 mould.
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References
M. Agirregabiria, F.J. Blanco, J. Berganzo, M.T. Arroyo, A. Fullaondo, K. Mayora & J.M. Ruano-López, Lab. Chip. 5 (2005)
A. Bertsch, H. Lorenz & P. Renaud, Sens. Actuators A 73 (1999)
B. Bohl, R. Steger, R. Zengerle & P. Koltay, J. Micromech. Microeng. 15 (2005)
F. Ceyssens & R. Puers, J. Micromech. Microeng. 16 (2006)
X. Chen, C. Liu, Z. Xu, Y. Pan, J. Liu & L. Du, Microsyst. Technol. 19 (2013a)
Y. Chen, W. Pei, R. Tang, S. Chen & H. Chen, Sens. Actuators A 189 (2013b)
P. Du, C. Cheng, H.B. Lu & X. Zhang, Journal of Microelectromechanical Systems 22 (2013)
D.C. Duffy, J.C. McDonald, O.J.A. Schueller & G.M. Whitesides, Anal. Chem. 70 (1998)
M. Han, W. Lee, S.K. Lee & S.S. Lee, Sens. Actuators A 111 (2004)
K. Kim, D.S. Park, H.M. Lu, W. Che, K. Kim, J.B. Lee & C.H. Ahn, J. Micromech. Microeng. 14 (2004)
W.R. Legant, C.S. Chen & V. Vogel, Integrative Biology 4 (2012)
W.R. Legant, A. Pathak, M.T. Yang, V.S. Deshpande, R.M. McMeeking & C.S. Chen, Proceedings of the National Academy of Sciences of the United States of America 106 (2009)
H. Lorenz, M. Despont, N. Fahrni, J. Brugger, P. Vettiger & P. Renaud, Sens. Actuators A 64 (1998)
H. Lorenz, M. Despont, N. Fahrni, N. LaBianca, P. Renaud & P. Vettiger, Micromech. Microeng. 7 (1997)
A. Mata, A.J. Fleischman & S. Roy, J. Micromech. Microeng. 16 (2006)
D. Sameoto & C. Menon, J. Micromech. Microeng. 19 (2009)
G.C. Shao, J.H. Wu, Z.L. Cai & W.J. Wang, Sensors and Actuators a-Physical 178 (2012)
D.C. Tan, I.P. Wijaya, M. Andreasson-Ochsner, E.N. Vasina, M. Nallani, W. Hunziker & E.K. Sinner, Lab Chip 12 (2012)
C.M. Waits, A. Modafe & R. Ghodssi, J. Micromech. Microeng. 13 (2003)
L. Wang, G.Y. Huang, B.Y. Sha, S.Q. Wang, Y.L. Han, J.H. Wu, T.J. Lu & F. Xu. Curr. Med. Chem. (2014)
B. Xu, Y. Lee, Q. Jin, J. Zhao & C.M. Ho, Sen. Actuators A 132 (2006)
H. Zou, J. Li, P. Jurcicek & G. Wang, Microelectron. Eng. 103 (2013)
Acknowledgments
This work was supported by the National Natural Science Foundation of China (51075056, 81301040, 91023046, 11372243), Program for New Century Excellent Talents in University of China (NCET-10-0284, NCET-12-0437), International Science & Technology Cooperation Program of China (2013DFG02930, S2013GR0241), China Young 1000-Talent Program, Dalian Foundation of Science and Technology (2012J21DW002), and Program for Youth Science and Technology Star of Shaanxi Province (2014KJXX-76).
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Liu, J., Zhang, D., Sha, B. et al. Fabrication of a three-layer SU-8 mould with inverted T-shaped cavities based on a sacrificial photoresist layer technique. Biomed Microdevices 16, 655–660 (2014). https://doi.org/10.1007/s10544-014-9868-y
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DOI: https://doi.org/10.1007/s10544-014-9868-y