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Numerical and experimental comparison of MEMS suspended plates dynamic behaviour under squeeze film damping effect

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Abstract

Dynamic behaviour of oscillating perforated microplates under the effect of squeeze film damping is analyzed. Two simplified finite element numerical approaches are adopted to predict damping and stiffness effects transferred from the surrounding ambient air to oscillating structures; the effects of holes cross section and plate dimension are observed. The applicability of the numerical models in terms of precision of results and mesh density is investigated. Results obtained by FE models are compared with experimental measurements conduced by an optical interferometric microscope.

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Acknowledgments

This work was partially funded by the Italian Ministry of University, under grant PRIN-2005/2005091729. Specimens were built by STMicroelectronics MEMS Business Unit (Cornaredo, Italy). Authors thank all the above involved institutions.

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Correspondence to Aurelio Somà.

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Somà, A., De Pasquale, G. Numerical and experimental comparison of MEMS suspended plates dynamic behaviour under squeeze film damping effect. Analog Integr Circ Sig Process 57, 213–224 (2008). https://doi.org/10.1007/s10470-008-9165-x

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  • DOI: https://doi.org/10.1007/s10470-008-9165-x

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