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Thermomechanical Analysis of Shape-Memory Composite Tape Spring

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Abstract

Intelligent materials and structures have been extensively applied for satellite designs in order to minimize the mass and reduce the cost in the launch of the spacecraft. Elastic memory composites (EMCs) have the ability of high-strain packaging and shape-memory effect, but increase the parts and total weight due to the additional heating system. Shape-memory sandwich structures Li and Wang (J. Intell. Mater. Syst. Struct. 22(14), 1605–1612, 2011) can overcome such disadvantage by using the metal skin acting as the heating element. However, the high strain in the micro-buckled metal skin decreases the deployment efficiency. This paper aims to present an insight into the folding and deployment behaviors of shape-memory composite (SMC) tape springs. A thermomechanical process was analyzed, including the packaging deformation at an elevated temperature, shape frozen at the low temperature and shape recovery after reheating. The result shows that SMC tape springs can significantly decrease the strain concentration in the metal skin, as well as exhibiting excellent shape frozen and recovery behaviors. Additionally, possible failure modes of SMC tape springs were also analyzed.

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Acknowledgements

This work was funded by Natural Science Foundations of China (no 11072027) and Ministry of Science and Technology (2009BAK58B02).

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  1. Department of Mechanics, School of Civil Engineering, Beijing Jiaotong University, Beijing, 100044, China

    H. Yang & L. Y. Wang

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  1. H. Yang
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  2. L. Y. Wang
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Correspondence to H. Yang.

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Yang, H., Wang, L.Y. Thermomechanical Analysis of Shape-Memory Composite Tape Spring. Appl Compos Mater 20, 287–301 (2013). https://doi.org/10.1007/s10443-012-9271-x

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