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Reversible bonding for microfluidic devices with UV release tape

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Abstract

For closed-channel microfluidic chips, a layer of the cover plate is usually bonded to the substrate layer to enclose the fabricated microstructures on the surface of the substrate. Various irreversible and reversible bonding approaches have been invented for glass, thermoplastic, and PDMS-based microfluidic devices in the recent decade, including anodic bonding, thermal fusion bonding, chemical solvent assisted bonding, sandwich adhesion layer, and oxygen plasma treatment. Currently, most of the reversible bonding methods have to make compromise on bonding strength to achieve the reversible bonding between the substrate and cover plate. In this study, a novel reversible bonding method is proposed with the help of a UV curable release tape, compared with previous methods on reversible bonding using a magnetic or adhesive layer, the proposed method offers a higher bonding strength and easily debond with a simple UV exposure process. The proposed reversible bonding method using UV release tape is inspired by the application of UV release tape in the wafer dicing process in MEMS and IC industry. For the demonstration of the proposed reversible bonding method for microfluidic devices, conventional and hybrid reversible bonding between thermoplastics and glass were achieved, the bonding strength was also measured with different UV radiation doses, the biocompatibility of the UV release tape was tested, finally, several microfluidic devices were fabricated with the proposed reversible bonding method.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (No. 51804014).

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Authors and Affiliations

  1. College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, 100029, China

    Yin Yao, Lu Li, Jiaxi Jiang, Yajun Zhang, Guohua Chen & Yiqiang Fan

  2. State Key Laboratory of Organic/Inorganic Composites, Beijing University of Chemical Technology, Beijing, 100029, China

    Yiqiang Fan

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  1. Yin Yao
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  2. Lu Li
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  3. Jiaxi Jiang
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  4. Yajun Zhang
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  5. Guohua Chen
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  6. Yiqiang Fan
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Correspondence to Yiqiang Fan.

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Yao, Y., Li, L., Jiang, J. et al. Reversible bonding for microfluidic devices with UV release tape. Microfluid Nanofluid 26, 23 (2022). https://doi.org/10.1007/s10404-022-02532-4

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