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Scattering of the SH wave from a crack in a piezoelectric substrate bonded to a half-space of functionally graded materials

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Abstract

The scattering of the SH wave from a crack in a piezoelectric substrate which is bonded to a half-space of functionally graded materials (FGM) is studied. The governing equations along with permeable crack boundary, regularity and continuity conditions across the interface are reduced to a coupled set of Cauchy singular integral equations which are solved approximately by applying Chebyshev polynomials. Numerical results for the normalized dynamic stress intensity factors (NDSIF) and the normalized electric displacement intensity factors (NEDIF) are presented. The effects of the geometric and physical parameters, and the effects of the frequency and the angle of incidence on NDSIF and NEDIF are discussed.

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Authors and Affiliations

  1. Faculty of Mathematics and Computer Science, Ningxia University, 750021, Yinchuan, People’s Republic of China

    Xing Li

  2. Faculty of Applied Mathematics, Yuncheng University, 044000, Yuncheng, People’s Republic of China

    Junqiao Liu

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  1. Xing Li
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  2. Junqiao Liu
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Correspondence to Xing Li.

Additional information

The authors are grateful for the support through NNSF of China (10661009) and State Key Development Program of Basic Research of China (2008CB617613).

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Li, X., Liu, J. Scattering of the SH wave from a crack in a piezoelectric substrate bonded to a half-space of functionally graded materials. Acta Mech 208, 299–308 (2009). https://doi.org/10.1007/s00707-009-0216-x

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  • DOI: https://doi.org/10.1007/s00707-009-0216-x

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