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Design and implementation of a 700–2,600 MHz RF SiP module for micro base station

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An Erratum to this article was published on 15 October 2014

Abstract

In this paper, we present a complete 700–2,600 MHz RF SiP module for micro base station. This RF SiP design integrates transmitter, receiver, feedback module, ADC/DAC and CLK module. The module consists of two multi-layer organic substrates that are vertically stacked using BGA interconnections. With the integration of 33 chips and about 600 passive components, this RF SiP module retains small form factor and measures 5.25 cm × 5.25 cm × 0.7 cm. The RF input signal transmission path insertion loss is less than 0.34 dB and the return loss is less than −14 dB at 2.6 GHz. Full load thermal simulation result indicates that each chip junction temperature is below 100 °C. We summarize the RF SiP module design, assembly and simulated thermal characteristics. The proposed RF SiP can generally be characterized by small size, low cost and short development cycle.

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Acknowledgments

The authors wish to acknowledge support from National Science and Technology Major Project under Project No. 2014ZX03001015-003.

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Authors and Affiliations

  1. Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Beitucheng West Road, Chaoyang, Beijing, 100029, China

    Yi He, Fengman Liu, Fengze Hou, Peng Wu, Jun Li, Liqiang Cao & Dongkai Shangguan

  2. National Center for Advanced Packaging (NCAP China), Building D1, 200 Linghu Boulevard, Wuxi, 214135, Jiangsu, China

    Yi He, Fengman Liu, Fengze Hou, Peng Wu, Jun Li, Liqiang Cao & Dongkai Shangguan

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  1. Yi He
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  2. Fengman Liu
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  3. Fengze Hou
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  4. Peng Wu
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  5. Jun Li
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  6. Liqiang Cao
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  7. Dongkai Shangguan
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Correspondence to Yi He.

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He, Y., Liu, F., Hou, F. et al. Design and implementation of a 700–2,600 MHz RF SiP module for micro base station. Microsyst Technol 20, 2295–2300 (2014). https://doi.org/10.1007/s00542-014-2314-5

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  • DOI: https://doi.org/10.1007/s00542-014-2314-5

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