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Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe package

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Abstract

The conventional exposed pad low-profile quad flat pack (E-pad LQFP) package is a low cost solution for multimedia chips, but its disadvantages are limited pin count and worse electrical characteristics. In order to increase their pin utilization rate and electrical characteristics for high-speed applications, an innovative leadframe package, named multiple exposed pads (M-pad) LQFP package, is proposed. By bonding all power and ground wires to their dedicated exposed pads, the leads originally bonded to the corresponding power and ground wires can be used as the spared leads for the other signals, or they can be just removed to reduce the lead numbers, and thus the size and cost of the M-pad leadframe package. The M-pad LQFP package was evaluated for manufacturing processes and electrical characteristics. The parasitics of power nets and S-parameters of high-speed differential signals were extracted using 3D electromagnetic field solvers. The simulated power parasitics of M-pad LQFP are much lower than those of E-pad LQFP and BGA packages. The simulated differential S-parameters of M-pad LQFP also indicate less signal loss compared with those of E-pad LQFP. The co-simulation of chip-(M-pad) package-board with multi-Gbps serial link was performed with well-behaved eye-diagrams that conform to high-definition multimedia interface (HDMI) specification.

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Acknowledgments

The authors would like to thank Steller Chang and Carl Wu in MediaTek, Taiwan for their helpful discussions. The authors would like to acknowledge Chip Implementation Center (CIC) of National Applied Research Laboratories (NARL) of Taiwan for the support in design environment. This work was supported by National Science Council of Taiwan (NSC 96-2221-E-005-091 and NSC 96-2220-E-005-005) and was supported in part by the Ministry of Education, Taiwan under the ATU plan.

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Authors and Affiliations

  1. Department of Electrical Engineering, National Chung-Hsing University, No. 250, Kuo-Kuang Rd., Taichung, 402, Taiwan

    Nansen Chen & Hongchin Lin

  2. Digital Home BU, MediaTek Inc, No. 1, Dusing Rd. 1, Hsinchu Science Park, Hsinchu, 300, Taiwan

    Nansen Chen

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  1. Nansen Chen
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  2. Hongchin Lin
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Correspondence to Nansen Chen.

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Chen, N., Lin, H. Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe package. Microsyst Technol 15, 367–374 (2009). https://doi.org/10.1007/s00542-008-0713-1

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  • DOI: https://doi.org/10.1007/s00542-008-0713-1

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