Skip to main content
Log in

3D-feature-based structure design for silicon fabrication of micro devices

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

To make MEMS structure design in a more intuitive way, and to support the “function to 3D shape to mask” design flow, a 3D feature based structure design framework and its corresponding key enabling techniques are presented on the basis of inverse design processes and top-down design methodologies. Driven by space mapping among function and structure, the feature model and its parameters are restricted with the bond graph represented simulation model, which is constructed with functional components in simulation library at the system-level. Conforming design rules, the hierarchic feature information model is established and finally can be cascaded down to a group of 3D feature nodes, which are all silicon fabrication oriented and defined on the top of CSG/B-rep 3D solid models. Surrounding this feature information model, the 2D mask deducing and fabrication parameters extraction at the fabrication-level can be performed for manufacturability checking, design/fabrication conflict feedback and fabrication process sequence generation. Taking a micro gap-closing actuator as an example, the structure design process is demonstrated in terms of this 3D feature modeling methodology.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12

Similar content being viewed by others

References

  • Antonsson EK (1996) Structured design methods for MEMS final report. California Institute of Technology, USA

    Google Scholar 

  • Bai Z, Bindel D, Clark J (2001) New numerical techniques and tools in SUGAR for 3D MEMS simulation. In: Technical proceedings of the 2001 international conference on modeling and simulation of microsystems, Orlando 1:31–34

  • Du HX (2004) Bulk micromachining of silicon physics simulation. Master thesis, Xi’an Jiaotong University, Xi’an

  • Fedder GK (2000) Top-down design of MEMS. In: Proceedings of the international conference on modeling and simulation of microsystems (MSM 2000) (27–29 March, 2000)

  • Finch N, Marchetti J, Fujita H, Gouy JP (2000) CAD modeling of scratch drive actuation, Design, modeling, and simulation in microelectronics 4228:83–89

  • Gabbay LD (1998) Computer aided macromodeling for MEMS, Thesis of Ph.D., MIT, USA

  • Gao F, Hong YS, Sarma R (2003) Feature model for surface micro-machined MEMS. In: Proceedings of ASME design engineering technical conferences, Chicago

  • Gunar L, Arthur M, Issam L (2001) Top-down design flow for MOEMS Proc SPIE 4408:126–137

    Article  Google Scholar 

  • Jack WJ (2001) Microelectromechanical systems (MEMS): fabrication, design and applications Smart Mater Struct 10:1115–1134

    Article  Google Scholar 

  • Johnstone RW, Shimizu T, Parameswaran M (2005) Symbolic finite element analysis for parametric studies. In: Technical proceedings of the 2005 NSTI nanotechnology conference and trade show 3:585–588

  • Li JH, Gao SM, Liu YS (2005) Feature-based process layer modeling for surface micromachined MEMS. J Micro Mech Micro Eng 15(3):620–635

    Google Scholar 

  • Liu Z, Jiang PY (2006) Systematic method for generating manufacturing process flow of micro devices based on feature technology. In: International conference on frontiers of design and manufacturing, Guangzhou

  • Liu C, Zhu ZJ (2000) Micromachining process simulation using a continuous cellular automata method. J Microelectromech Syst 9(2):252–261

    Article  Google Scholar 

  • Liu Y, Jiang PY, Liu Z (2005) Dynamic system modeling and simulation using bond-graph-based micro-components library for microelectromechanical systems. J Xi’an Jiaotong University 39(7):744–748

    Google Scholar 

  • McCorquodale MS, et al (2003) A top-down microsystems design methodology and associated challenges. In: Proceedings of the design, automation and test in Europe conference and exhibition, Berlin 1:292–296

  • Senturia SD, Harris RM, Johnson BP, Kim S, Shulman MA, White JK (1992) A computer-aided design system for microelectromechanical systems. IEEE/ASME J Microelectromech Syst 1:3–13

    Article  Google Scholar 

  • Tamal M (2003) MEMS design and verification, test conference, proceedings. ITC 2003 Int 1:681–690

    Article  Google Scholar 

  • Vandemeer JE (1998) Nodal design of actuators and sensors, Technical Report. Carnegie Mellon University, Pittsburgh

    Google Scholar 

  • Wong G (2004) Behavioral modeling and simulation of MEMS electrostatic and thermomechanical effects, Thesis of M.S., Carnegie Mellon University, Pittsburgh

Download references

Acknowledgment

This project is under support of both Natural Science Foundation of China (NSFC, Grant No. 50375118 and 5014006) and the Program for New Century Excellent Talents in University by China Ministry of Education (CMOE, Grant No. NCET-04-0928). The authors hereby thank them for the financial aid.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Pingyu Jiang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Liu, Y., Jiang, P., Zhang, D. et al. 3D-feature-based structure design for silicon fabrication of micro devices. Microsyst Technol 13, 701–714 (2007). https://doi.org/10.1007/s00542-006-0371-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-006-0371-0

Keywords

Navigation